Agilent Technologies, Inc.

Avago Technologies General IP (singapore) Pte. Ltd.

Other

Silicon Image Gmbh

Mohammed Ershad Ali

Brian Elliot Lemoff

Steven Rosenau

Lisa Anne Windover

Jonathan Noah Simon

Lisa Anne Buckman

Edwin De Groot

Described herein are an apparatus, system, and method having a compact symmetrical transition structure for RF applications. The apparatus comprises: first and second ground planes each of which having respective truncated edges, the first and second ground planes being parallel to one another and separated by a multi-layer substrate; a strip line positioned between the first and second ground planes; and a symmetrical transition structure, coupled to the strip line and the first and second ground planes near their respective truncated edges, and further coupled to a broadside coupled line (BCL).

Apparatus, system, and method for a compact symmetrical transition structure for radio frequency applications

A high-speed multiple channel and line selector switch allows the simultaneous selection of the two lines of a differential channel and permits the simultaneous selection of multiple channels by introduction of the appropriate high speed pad connectivity.

Method and apparatus for high-speed multiple channel and line selector switch

A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads. The flexible circuit also includes vias disposed proximate the first type of electrical connection pads and extended through the ground plane to provide for electrically coupling the first transmission line and the second transmission line, such that the vias reduce discontinuity in the ground plane and aggregate discontinuity in the flex circuit.

Via placement for layer transitions in flexible circuits with high density ball grid arrays

A driver IC and EML array are electrically coupled to one another via a flexible PCB. Thermal isolation between the driver IC and EML array is adjusted by varying a cross-section and length of electrically-conductive traces on the PCB.

Method and apparatus for interconnecting a laser array and an integrated circuit of a laser-based transmitter

An embodiment in accordance with the invention recites a high speed channel selector switch. The high speed channel selector switch includes a first unit that has a plurality of contacts that are operable to electrically couple to a plurality of high speed data lines of a device under test. The first unit also has an additional contact operable to electrically couple to a signal line. The high speed channel selector switch further includes a second unit that is operable to selectively electrically couple one of the plurality of contacts of the first unit to the additional contact of the first unit. The second unit also electrically couples the remaining contacts of the first unit to respective termination impedances. Thus, one of the plurality of high speed data lines is coupled to the signal line via the second unit and the remaining high speed data lines are coupled to respective termination impedances.

High speed channel selector switch

A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.

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Sunnyvale, CA, United States of America

Mohammed Ershad Ali