Sun Microsystems, Inc.

Mohammed A Tantoush

Kenneth Kitlas

Satyanarayana Nishtala

Alan Lee Winick

Anita Patel

Kenneth A Lown

Alan W Lam

Winiie C Leung

The electronic device with a system for enhancing the cooling of components located therein is provided. The device includes a housing with a fan positioned adjacent the housing and adapted for producing airflow within the housing. The printed circuit board is mounted within the housing, and a heat-producing device is mounted on the printed circuit board. The heatsink is coupled to the heat-producing device, and a shroud is mounted on the printed circuit board and extends up to the heatsink so as to improve airflow in the region adjacent the heatsink.

Method and apparatus for removing heat from an electronic device

A heat sink for cooling a high power consumption device, such as a central processing unit (device), has extended heat transfer areas. In an embodiment, the extended heat transfer areas may include fins protruding from portions of a heat sink base. The extended heat transfer area of the heat sink may overhang an area of a circuit board adjacent to the high power consumption device. Low power consumption components, such as memory chips, can be mounted on the circuit board in close proximity to the high power consumption device and beneath the heat sink. The low power consumption component may have separate heat sinks that attach to the low power consumption components and extend beyond the base of the high power consumption device heat sink.

Extended surface area heat sink

A computer system housing where a vertical printed circuit board, e.g., a riser card, is inserted into a socket on a computer system motherboard. Some internal space within the housing may allow optimization of system memory capacity through packing of additional memory modules on the riser card. The additional memory may be mounted on the riser card and may reside in the vertical space created between the riser card and the directly-mounted memory on the motherboard. The computer system housing further includes a chassis that may be partitioned into two separate sub-chassis for proper positioning of one or more cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis. The cooling fans may be mounted at such locations on the chassis that allow optimization of air circulation and, hence, cooling within the housing. However, extra cooling fan(s) for the additional memory on the riser card may not be necessary in view of the creation of dedicated cooling channels within the housing by an efficient placement of the cooling fans. The optimization of fan placement within the housing results in efficient cooling of various system components and allows for increase in system component packing density without a similar increase in the number of cooling fans.

Computer system cooling configuration

A slug or plate of copper or some other material having high heat conductivity is attached by an adhesive such as epoxy to a heat-emitting electrical component such as a chip, ASIC, microprocessor, or the like. A heat sink having a base and a plurality of fins upstanding from the base is attached to the slug or plate by screws, nuts or other, preferably detachable, means. The bottom of the base may be formed with a socket to receive the slug. The heat sink may be larger than the slug, thereby improving heat dissipation. When it is necessary to replace the component, the heat sink is detached from the slug and re-used.

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Fremont, CA, United States of America

Mohammed A Tantoush