Broadcom Corporation

Avago Technologies General IP (singapore) Pte. Ltd.

Mohammad Tabatabai

Mehmet Vakif Tazebay

Ahmad Chini

Sesha Thalpasai Panguluri

Abbas Amirichimeh

Lorenzo Longo

Neven Pischl

Richard Togashi

A circuit for power on data line (PoDL) injection includes a power source, a first and a second coupling component, and an interface. The power source provides one or more DC voltage levels. The first coupling component couples the power source to an interface for coupling to a transmission medium. An Ethernet device is coupled through the second coupling component to the interface. The first coupling component is a balanced component, and the Ethernet device is isolated from the power source via a pair of DC blocking capacitors connected between the first coupling component and the second coupling component.

Power coupling circuits for single-pair ethernet with automotive applications

A system and method for switching in an energy efficient network. Rapid switching between multiple operating modes can generate a voltage spike or voltage lag on an on-board inductor. Suppression of the voltage spike or voltage lag can be enabled through the activation of by a physical layer device of an inductor bypass path at a time proximate to the switching between multiple operating modes.

System and method for switching in an energy efficient network

Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

Apparatus and method for grounding an IC package lid for EMI reduction

According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Enhanced electromagnetic coupling between a transmission line pair with reduced electromagnetic coupling to ground

Transmission line pairs with enhanced coupling therebetween and negligible coupling to ground

A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Growing community of inventors

Newport Beach, CA, United States of America

Mohammad Tabatabai