Fujikura Limited

Mohammad Shahed Ahamed

Yuji Saito

Akihiro Takamiya

Makoto Takahashi

Tsuyoshi Ogawa

Yuichi Yokoyama

Koichi Mashiko

Thanhlong Phan

Youji Kawahara

An optical transceiver includes a case including a heat sink, one or more heat generating bodies disposed in the case, one or more heat conducting portions protruding from an inner wall surface of the case and thermally contacting the one or more heat generating bodies, and a heat pipe that transfers heat from the one or more heat conducting portions to the heat sink.

Optical transceiver

A heat spreading module for a portable electronic device includes a metal plate to which a heat generation body contacts, a first heat pipe that is attached along the metal plate, transfers heat of a heating region of the metal plate, to which the heat generation body contacts, to a region that is away from the heating region of the metal plate, comprises a first end portion and a second end portion, has a predetermined length, and a portion of the first end portion is arranged in the heating region, and a second heat pipe that is arranged away from the heating region and is longer in length than the first heat pipe.

Heat spreading module for portable electronic device

A cooling structure for a portable electronic device is provided, configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component. The heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end is attached by being sandwiched between the heat-generating component and the heat sink while another end is arranged in close contact with the heat sink.

Cooling structure for portable electronic device

A heat pipe having enhanced heat transport capacity that can be manufactured easily is provided. The heat pipecomprises a sealed containerand a wick structure. The wick structure includes a first wickformed of copper fibers, and a second wick formed of carbon fibers. The first wickis sintered to be fixed to an inner faceof a flat wallwhile holding the second wicktherein.

Heat pipe

In a heat spreading module for a portable electronic device configured such that a heat pipe is attached along a metal plate with which a heating element is brought into close contact, and heat of a heated region of the metal plate with which the heating element is brought into close contact is transferred to a place on the metal plate apart from the heated region by the heat pipe, the heat pipe is configured such that a container is formed of a pipe, a portion of the container arranged on the heated region is a heated portion, and a portion of the container apart from the heated region is a heat dissipation portion that dissipates heat to the metal plate, and the heated portion is formed in a flat shape, and the heat dissipation portion is formed to be thicker than the heated portion having the flat shape.

In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.

Growing community of inventors

Tokyo, Japan

Mohammad Shahed Ahamed