Cisco Technology, Inc.

Mohammad Reza Danesh Kadivar

Peter Alf Joakim Fornell

Nancy Gayed

Hong Huynh

Susheela N Narasimhan

Saeed Seyed

Nguyen Nguyen

James Thomas Theodoras

Jacqueline Lee Belleau

Frank S Jun

Yewen Li

Saeed Sayed

Nguyen T Nguyen

Portable low profile flexible angle stand for electronic devices

Display mounting bracket for a video conference system endpoint

A dual-cam ejector assembly for a card, such as a line card, is provided. The ejector assembly comprises an elongated ejector arm having its distal end coupled to the line card so as to provide a first axis of rotation for the ejector arm. The ejector assembly further comprises an ejector cam coupled to the line card so as to provide a second axis of rotation for the ejector cam. The ejector assembly also comprises a cam pin extending from the ejector cam that couples the ejector cam to the ejector arm such that pivoting of the ejector arm around the first axis of rotation causes the ejector cam to pivot around the second axis of rotation.

Dual-cam ejector assembly

Wall mounting bracket for a video conference system endpoint

Remote control for a video conference system endpoint

In one embodiment, the present disclosure refers to an apparatus comprising a bracket having a base configured to receive and hold a first electronic element. The bracket comprises at least one flange extending from the base and at least one guide acting to align the bracket and first electronic element with a second electronic element. The bracket also comprises at least one fastener aligned with the at least one guide and acting to engage and hold the second electronic element.

Aligning bracket

Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.

Heatsink attachment mechanism

Growing community of inventors

Santa Clara, CA, United States of America

Mohammad Reza Danesh Kadivar