Lsi Logic Corporation

Mohammad R Mirbedini

Venkatesh P Gopinath

Verne C Hornback

Hong Lin

Dodd Defibaugh

Ynhi Thi Le

Dual trench depths are achieved on the same wafer by forming an initial trench having a depth corresponding to the difference in final depths of the shallow and deep trenches. A second mask is used to open areas for the deep trenches over the preliminary trenches and for the shallow trenches at additional locations. Etching of the shallow and deep trenches then proceeds simultaneously.

Growing community of inventors

Redwood City, CA, United States of America

Mohammad R Mirbedini