Xerox Corporation

Mohammad M Mojarradi

Tuan Anh Vo

Abdul M ElHatem

Dennis W Sandstrom

Steven A Buhler

Kaiser H Wong

James M Donohue

Mehrdad Zomorrodi

Jaime Lerma

Abdul M Elhatem

Paul C Tien

Hung C Nguyen

Charles C Currie

Charles E Morand

Sousanna Kardashian

Masaji Sato

A method of creating a plurality of fine pitch integrated interconnects utilizes a flexible layer to create a plurality of integrated interconnects which extend beyond the boundary of the integrated circuit chip onto the substrate. Subsequently, a support layer is deposited on the interconnects and the substrate under the plurality of interconnects which is located beyond the boundary of the integrated circuit chip is removed.

Integrated flexible interconnection

An apparatus for transporting charged particles in a predetermine path which includes a donor member that is adapted to move charged particles on the surface thereof in the predetermined path. The donor member includes an electrode array on the outer surface thereof; the array including a plurality of spaced apart electrodes extending substantially across width of the surface of the donor member. A multi-phase DC voltage source is operatively coupled to the electrode array, the phase being shifted with respect to each other such as to create an electrodynamic wave pattern capable of moving charged particles on the surface thereof in the predetermined path.

Flexible donor belt employing a DC traveling wave

An integrated CMOS diode with an injection ring that enables construction of an integrated CMOS RF switch. Construction techniques of using a diffused n-well resistor, parasitic capacitance and construction of the diode underneath a bonding input pad contribute to performance of the switch as well as saving space needed to construct the switch.

Integrated RF switching cell built in CMOS technology and utilizing a

A method in which several high voltage chips may be packaged within a single, typically low voltage plastic package. The high voltage chips are packaged to remain electrically isolated from each other to avoid undesirable side effects such as arcing between the chips but able to share electronic data and communicate with each other electronically through their input and ouput nodes. Due to the unique packaging method, the typically low voltage plastic packaging can be made to withstand operating voltages up to 35 times greater than previously attained by such low voltage plastic packaging.

Method of packaging a high voltage device array in a multi-chip module

A development system which includes a flexible donor belt having groups of electrode array near the surface of the belt is disclosed. The Electrode array has group areas in which perform the function of: Loading; Transferring; Developing; Transferring and Unloading. Each electrode array group area is independently addressable and operatively connected to voltage source in order to supply a voltage in the order of .quadrature.0-1000 volts AC or DC to each group area. The electrodes array group area picks up the toner from the magnetic brush. An electrode array group area connected to the voltage source via phase shifting circuitry such that a traveling wave pattern is established. The electrostatic field forming the traveling wave pattern pushes the charged toner particles about the surface of the donor belt from the magnetic brush to the photoconductive belt where they are transferred to the latent electrostatic images on the belt by an electrode group area which generates a toner cloud in the development zone. Thereafter, toner is moved by an electrode array group area where an electrode group area is bias to unload remaining toner off the belt.

Flexible donor belt

An electronic circuit package in which several high voltage components are packaged along with low voltage components using standard circuit boards and minimizing the space needed for the entire assembly. A miniature circuit board, constructed of standard circuit board material, is used to mount several electronic components, some of which require high voltages. To meet isolation requirements, requiring a dielectric strength more than that provided by the board itself, between the high and low voltage nodes the circuit board incorporates slots or other cut out shapes in the board. The slots or other cut out shapes provide two functions. The first use for the slots or other cut out shapes is to prevent charge migration on the surface of the board between high and low voltage nodes. This is accomplished by placing the slots or other cut out shapes between high and low voltage nodes. The circuit board is then encapsulated within a potting material. The slots or other cut out shapes perform a second function of allowing the potting material to flow around and through the board to facilitate full encapsulation of the board and the electronic devices on the board. Several of the slots or other cut out shapes are placed in the board directly underneath the electronic devices mounted on the board to aid in allowing the potting material to completely surround and encapsulate the electronic devices.

Method of packaging high voltage components with low voltage components

A low profile interconnect is used for electronic connections to segmented electrode donor rolls in which at least 78 interconnections between the segmented donor roll and a commutator can be made with a profile of approximately 10-15 mils, which retains reliability in an approximately 600 rpm rotational environment and which withstands 2000 volts between adjacent lines.

Low profile interconnect for a segmented electrode donor roll and a

An improved optically controlled power supply regulator in which an optoisolator transistor is controlled by an input light emitting diode replaces an optically controlled power supply regulator with a light emitting diode controlled with a light dependent resistor. The optically controlled power supply regulator utilizes a capacitor and a resistor to reduce loop response oscillation in order to prevent the optically controlled power supply regulator from being shut down on a system board.

Power supply regulator

High voltage circuitry often requires assembling an array of high voltage devices that are electrically isolated from one another. A lead frame that fits within conventional plastic packaging has been designed that will allow electrical isolation of the substrates of two or more transistors mounted together in a single package.

Growing community of inventors

Pullman, WA, United States of America

Mohammad M Mojarradi