Formfactor, Inc.

Lsi Logic Corporation

Mohammad Eslamy

David V Pedersen

Harry D Cobb

Larry L Jacobsen

A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

Method of repairing segmented contactor

Method of fabricating segmented contactor

Segmented contactor

An apparatus and method of making a void free interface between a heatspreader and pressure sensitive adhesive (PSA) by attaching them in an air free environment. The PSA is placed on a pedestal in a vacuum chamber assembly, then the heatspreader is placed on top of the PSA and the chamber is closed. The air is removed by a vacuum means, creating an air free environment. Once the desired vacuum is obtained and the air is removed, pressure is applied to the heatspreader and PSA, joining them together with a void free interface between them. After joining, the vacuum is released and the vacuum chamber assembly is opened so that the heatspreader with PSA attached can be removed. The heatspreader with PSA is now ready for use with a semiconductor package. Additionally, the heatspreader with PSA may be joined to the integrated circuit die of a semiconductor package in an air free environment by the same process (using vacuum and pressure) as describe above.

Enhanced lamination process between heatspreader to pressure sensitive

A semiconductor device and fabrication method are presented which employ a thermally conductive substrate having an outer layer of palladium. The substrate may be made of, for example, a metal such as copper. The substrate does not itself include layers of signal traces or bonding pads which function as device terminals, but provides a stiff backing for support of a flexible circuit which includes signal traces and bonding pads. An adhesive layer bonds the flexible circuit to the substrate. The outer layer of palladium has a desired surface roughness and chemical properties which improve the adhesion of the adhesive layer to the substrate. The substrate has opposed, substantially planar upper and underside surfaces. In one embodiment, the underside surface of the substrate has a die cavity, and the flexible circuit includes a set of conductors bonded to one side of a sheet of dielectric material (e.g., polyimide film). The sheet of dielectric material has an opening extending therethrough for receiving an upper surface of an integrated circuit. Each conductor has a first end which extends laterally across the film and into the opening and a second end which terminates at a bonding pad. The opening is surrounded by multiple apertures also which allow access to the substrate through the sheet of dielectric material for the bonding of a portion of the conductors to the substrate. The adhesive layer has openings which correspond to those of the sheet of dielectric material.

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San Jose, CA, United States of America

Mohammad Eslamy