Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Mohammad Akhavin

Joseph Edward Scheffelin

David K McElfresh

Brian J Keefe

Janis Horvath

Pere Esterri

Noah C Lassar

Stanley G Markwell

Jospeh E Scheffelin

A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Substrate for fluid ejection devices

A method of forming a fluid ejection assembly includes providing a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, extending a support between opposite sides of each of the fluid passages, and mounting a plurality of fluid ejection devices on the substrate, including communicating each of the fluid ejection devices with one of the fluid passages.

Method of forming substrate with fluid passage supports

A fluid ejection assembly includes a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, with each of the fluid passages having a support extending between opposite sides thereof, and a plurality of fluid ejection devices each mounted on the substrate and communicating with a respective one of the fluid passages.

Substrate with fluid passage supports

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Escondido, CA, United States of America

Mohammad Akhavin