Applied Materials, Inc.

Infineon Technologies Ag

Mohamed Rafi

Arvind Sundarrajan

Guan Huei See

Prayudi Lianto

Eric J Bergman

John Lee Klocke

Sriskantharajah Thirunavukarasu

Karthik Elumalai

Ming Xue

Giji Hervias Juele

Kuma Hsiung

Muhammad Azim

Muhammad Azim Bin Syed Sulaiman

Ang Yu Xin Kristy

Nam Teck Shannon Teo

Teck Hui Wong

Methods and apparatus for producing fine pitch patterning on a substrate. Warpage correction of the substrate is accomplished on a carrier or carrier-less substrate. A first warpage correction process is performed on the substrate by raising and holding a temperature of the substrate to a first temperature and cooling the carrier-less substrate to a second temperature. Further wafer level packaging processing is then performed such as forming vias in a polymer layer on the substrate. A second warpage correction process is then performed on the substrate by raising and holding a temperature of the substrate to a third temperature and cooling the substrate to a fourth temperature. With the warpage of the substrate reduced, a redistribution layer may be formed on the substrate with a 2/2 &#x3bc;m l/s fine pitch patterning.

Methods and apparatus for controlling warpage in wafer level packaging processes

A system includes an inert gas supply, a soak chamber, a test chamber, a transfer zone, and a heater. The soak chamber soaks an integrated circuit (IC) device in the inert gas prior to testing. The test chamber includes contact pins for testing the IC device in the inert gas by contacting the contact pins to leads of the IC device. The transfer zone is to transfer the IC device from the soak chamber to the test chamber. The heater heats the inert gas supplied to the soak chamber and the test chamber.

Integrated circuit device testing in an inert gas

A polymer layer on a substrate may be treated with ozone gas or with deionized water and ozone gas to increase a removal rate of the polymer layer in a chemical mechanical polishing (CMP) process. The ozone gas may be diffused directly into the polymer layer or through a thin layer of deionized water on the surface of the polymer layer and into the polymer layer. The deionized water may also be heated during the process to further enhance the diffusion of the ozone gas into the polymer layer.

Methods for chemical mechanical polishing (CMP) processing with ozone

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Singapore, Singapore

Mohamed Rafi