Zhejiang Kaiying New Materials Co., Ltd.

Twin Creeks Technologies, Inc.

Pharos Materials, Inc.

Gtat Corporation

University of Texas System

Molecular Imprints, Inc.

Mohamed M Hilali

Zhiyong Li

Christopher John Petti

Venkatesan Murali

Jifeng Wei

S Brad Herner

Theodore H Smick

Gopalakrishna B Prabhu

Kathy Jackson

Xiangling Xu

Yaping Zhang

Sidlgata V Sreenivasan

Frank Y Xu

Gerard M Schmid

Michael Nevin Miller

Shuqiang Yang

Fen Wan

Liang Kai Wang

Zhang Wei

Mark Harold Clark

Gopal Prabhu

Intermediate temperature metallization pastes containing vanadium are disclosed. The metallization pastes can be used to fabricate electrodes interconnected to a transparent conductor.

Vanadium-containing electrodes and interconnects to transparent conductors

Screen-printable metallization pastes for forming thin oxide tunnel junctions on the back-side surface of solar cells are disclosed. Interdigitated metal contacts can be deposited on the oxide tunnel junctions to provide all-back metal contact to a solar cell.

Interdigitated back contact metal-insulator-semiconductor solar cell with printed oxide tunnel junctions

Peripheral side surface interconnects for interconnecting solar cells are disclosed. The peripheral side surface interconnects include a layer of an electrically conductive adhesive overlying an insulating layer overlying a peripheral side edge of a solar cell and electrically interconnected to a busbar. Photovoltaic modules include adjacent solar cells comprising peripheral side surface interconnects interconnected by the electrically conductive adhesive or by the electrically conductive adhesive and an interconnection element. An interconnection element can be a solder paste or a solder containing electrically conductive ribbon. Methods of forming solar cell peripheral side surface interconnects include applying an insulating layer to a side surface of a solar cell, depositing a busbar in proximity to the insulated side surface of the solar cell, depositing an electrically conductive adhesive over at least a portion of the busbar and over at least a portion of the insulating layer. Photovoltaic modules can be formed by interconnecting adjacent solar cells using a peripheral side surface interconnect.

Solar cell side surface interconnects

Edge interconnects for interconnecting solar cells are disclosed. The edge interconnects include a layer of an electrically conductive adhesive overlying an insulating dielectric layer applied to edge of a solar cell and electrically interconnected to a busbar. Solar cell modules include adjacent solar cells comprising edge interconnects interconnected using an interconnection element. An interconnection element can be a solder paste or a solder containing electrically conductive ribbon. Methods of forming solar cell edge interconnects include applying an insulating dielectric coating to edges of a solar cell, depositing a busbar in proximity to the insulated edges of the solar cell, depositing an electrically conductive adhesive over at least portion of the busbar an over at least a portion of the dielectric layer. Solar cell modules can be formed by interconnecting adjacent solar cells using an interconnection element.

Solar cell edge interconnects

Frontside metallization pastes for solar cell electrodes contain siloxanes. Metallization pastes containing siloxanes can be used to fabricate fine line, high aspect ratio, solar cell gridlines.

Siloxane-containing solar cell metallization pastes

Growing community of inventors

San Ramon, CA, United States of America

Mohamed M Hilali