Occidental Chemical Corporation

Hooker Chemicals & Plastics Corporation

Omi International Corporation

Mohamed F El-Shazly

Kenneth D Baker

Yvonne Rymwid

Alan A Halecky

Electroless gold plating baths for plating metallized ceramics wherein the bath comprises (a) alkali metal gold cyanide, (b) alkali metal fluoride, and (c) alkali metal hydroxide. The baths may optionally contain a buffering agent and/or ammonium hydroxide and/or an organic chelating agent. The metallized ceramics contain tungsten, molybdenum, electroless nickel, copper and the like. The gold constituent in the alkali metal gold cyanide may be monovalent, trivalent or mixtures thereof. The method of utilizing such electroless or autocatalytic plating baths is also described and claimed.

Electroless direct deposition of gold on metallized ceramics

An electroless plating process for depositing gold on substrates, such as metal and metallized substrates, which involves immersing the substrates in an electroless plating bath composed of a trivalent gold complex, an organic carboxylic acid, and/or a mineral acid sufficient in amount so that the pH of the bath will range from about 0.1 to 6.0. The process of utilizing said electroless bath to deposit gold on the aforementioned substrates is also disclosed and claimed.

Process for the immersion deposition of gold

Improved electroless or autocatalytic gold plating baths wherein the gold ingredient is a water soluble trivalent gold component selected from an alkali metal auricyanide, an alkali metal aurihydroxide, and an alkali metal aurate. The bath contains an amino borane, an alkali metal borohydride, or an alkali metal cyanoborohydride as the reducing agent; an alkaline agent such as an alkali metal hydroxide; and an alkaline buffering agent. Optionally, the bath may contain added alkali metal cyanide. The method of utilizing such electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a non-metallic substrates is also described and claimed.

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Bloomfield, NJ, United States of America

Mohamed F El-Shazly