Avago Technologies International Sales Pte. Limited

Broadcom International Pte. Ltd.

Mohamed Anwar Ali

Roger A Fratti

Tauman T Lau

James Robert Church

Thinh Quang Tran

Sudersan Sampath

An electrical device for transporting electrical signals, wherein the electrical device comprises a plurality of signal wires each configured for transporting electrical signals, and a plurality of shield wires being staggered with respect to each other and each being configured for shielding signal wires with respect to each other, wherein each shield wire is arranged between a respective pair of signal wires and extends only along a subsection of each signal wire of the respective pair.

Staggered shield wires extending along subsections of signal wires

A semiconductor package includes an interposer, a number of a first integrated circuit (IC) dies, one or more second IC dies, and one or more dummy dies. The first IC dies, the second IC dies and the dummy dies are implemented on the interposer. The dummy dies are configured to enable routing of pins of the first IC dies to selected circuits of the second IC dies while conforming to predefined routing rules.

Extended HBM offsets in 2.5D interposers

Growing community of inventors

San Jose, CA, United States of America

Mohamed Anwar Ali