Skyworks Solutions, Inc.

Mohamed A Megahed

Roberto Coccioli

Hassan S Hashemi

John S Walley

Trang Trinh

Larry D Vittorini

Kevin J Cote

Hashemi S Hassan

According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

Embedded antenna and semiconductor die on a substrate in a laminate package

According to an embodiment, a semiconductor die has a source bond pad and a destination bond pad attached to a top surface of the semiconductor die. A stud bump is situated on the destination bond pad. A bonding wire is then ball bonded to the source bond pad and thereafter stitch bonded to the stud bump on the destination bond pad. The bonding wire acts as an off-chip inductor or a portion of an off-chip inductor. In one embodiment a number of bonding-wires and on chip conductors are used to form an off-chip inductor. The inductance of the off-chip inductor can be adjusted or fine-tuned by adjusting a loop height of the one or more bonding wires used in the off-chip inductor. The inductance of the invention's off-chip inductor can also be adjusted by increasing or decreasing the number of bonding wires used to form the off-chip inductor.

Off-chip inductor

One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated on a bottom surface of the laminate substrate, where the antenna element is suitable for connection to the semiconductor die. According to this exemplary embodiment, the structure further comprises a laminate substrate reference pad in the laminate substrate, where the laminate substrate reference pad is situated over the antenna element. The exemplary structure further comprises at least one laminate substrate reference via situated at a side of the antenna element. The at least one laminate substrate reference via can be electrically connected to the laminate substrate reference pad. The at least one laminate substrate reference via can be electrically coupled to a printed circuit board reference via in a printed circuit board.

Shielded antenna in a semiconductor package

One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate signal bond pad and a semiconductor die signal bond pad. In another disclosed embodiment, an inductor is fabricated within the substrate. The inductor comprises via metal segments connecting interconnect metal segments on the top and bottom surfaces of the substrate. The first and second terminals of the inductor are easily accessible through first and second substrate signal bond pads. One embodiment comprises at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and a printed circuit board attached to the bottom surface of the substrate.

Leadless chip carrier with embedded inductor

A substrate has a top surface for receiving a semiconductor die. An antenna is patterned on the bottom surface of the substrate. The antenna is accessible by coupling it to a via and, through the via, to a substrate signal bond pad and a semiconductor die signal bond pad. In one embodiment, there is at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a substrate bond pad and the printed circuit board. The at least one via also provides an electrical connection between the signal bond pad of the semiconductor die and a land that is electrically connected to the printed circuit board.

Growing community of inventors

San Diego, CA, United States of America

Mohamed A Megahed