Future Wei Technologies, Inc.

Mo Bai

Vadim Gektin

A fluid coupling mating apparatus and method. Included is at least one mating member for removably coupling with another mating member for allowing fluid to pass therebetween. A lock is movably coupled to the at least one mating member. Still yet, a holder is coupled to the lock for holding the lock in relation to the holder during at least a portion of the removable coupling of the at least one mating member with another mating member.

Fluid coupling mating apparatus and method

The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.

Stationary cooling structure for board/chassis-level conduction cooling

A heat spreader and a method for making a heat spreader are disclosed. In an embodiment the heat spreader includes an enclosure with a hollow core and a foam core located in the hollow core.

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San Jose, CA, United States of America

Mo Bai