Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Mizuho Ishikawa

Satoshi Sakurai

Syunji Yoshimi

Kazuhiro Ueda

Yuri Honda

Fuminori Morisawa

Takeyuki Okabe

A communication circuit includes a transmission terminal to which a transmission signal is supplied, a first duplexer that has a transmission node, a reception node, and a common node, a first filter that has a first end part electrically connected to the common node of the first duplexer and a second end part electrically connected to an antenna terminal, a first auxiliary output terminal that outputs the transmission signal to an external circuit, an inductor that is part of a second filter and has a first end part and a second end part that is electrically connected to the first auxiliary output terminal, and a first switch that switches the electrical connection destination of the transmission terminal between the transmission node of the first duplexer and the first end part of the inductor.

Communication circuit and communication device

A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 μm or less.

Semiconductor device including semiconductor chip having elongated bumps

A high-frequency signal transmission-reception circuit includes a plurality of band pass filter groups each including a plurality of band pass filter pairs; a first switch including a plurality of band pass filter-side terminal groups each including a plurality of band pass filter-side terminals, and an antenna-side terminal group; a plurality of couplers configured to output respective signal strengths of high-frequency signals transmitted on a plurality of transmission paths; and a second switch including an input terminal group electrically connected to the plurality of couplers, and an output terminal configured to output a detection signal output from one of the plurality of couplers. The first switch electrically connects one band pass filter-side terminal in one band pass filter-side terminal group and one antenna-side terminal, and also electrically connects one band pass filter-side terminal in another band pass filter-side terminal group and another antenna-side terminal.

High-frequency signal transmission-reception circuit

A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 &#x3bc;m or less.

A control circuit includes a first output unit configured to output a constant bias current for setting an electrical bias state of a bias circuit to the bias circuit; a second output unit configured to output a bias control current or constant voltage for controlling the electrical bias state of the bias circuit to the bias circuit; a resistor having one end connected to a reference potential; and a switch provided between another end of the resistor and an output terminal of the second output unit.

Control circuit for power amplifier

A power amplification module includes first and second amplifiers for first and second communication modes, a bypass line that bypasses the first or second amplifier, an input switch circuit that supplies a radio frequency signal to the first or second amplifier in accordance with a communication mode when a desired output level is equal to or greater than a reference level, and that supplies a radio frequency signal to the bypass line when the desired output level is less than the reference level, and an output switch circuit that outputs a first amplified signal from the first amplifier or a second amplified signal from the second amplifier in accordance with the communication mode when the desired output level is equal to or greater than the reference level, and that outputs a radio frequency signal output from the bypass line when the desired output level is less than the reference level.

Power amplification module

A power amplification module includes first and second amplifiers for first and second communication modes, a bypass line that bypasses the first or second amplifier, an input switch circuit that supplies a radio frequency signal to the first or second amplifier in accordance with a communication mode when a desired output level is equal to or greater than a reference level and supplies a radio frequency signal to the bypass line when the desired output level is less than the reference level, and an output switch circuit that outputs a first amplified signal from the first amplifier or a second amplified signal from the second amplifier in accordance with the communication mode when the desired output level is equal to or greater than the reference level and outputs a radio frequency signal output from the bypass line when the desired output level is less than the reference level.

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Kyoto, Japan

Mizuho Ishikawa