Tdk Corporation

Megachips Corporation

Ntt Electronics Corporation

Miyuki Yanagida

Hisayuki Abe

Akira Sato

Atsushi Sato

Takashi Yamada

Kenichi Kawabata

Hiromu Hasegawa

Yasuo Watanabe

Takashi Ota

Susumu Taniguchi

Masumi Kameda

Makoto Saito

Makoto Endo

Makoto Orikasa

Takuya Aoki

Masakazu Hosono

Koichi Yamaguchi

Katsuhiko Igarashi

Yoshihiro Kanbayashi

Shuji Higashi

Naoki Chida

Yukari Inoue

Masataka Kitagami

Haruya Hara

Mitsuru Kojima

An electrode for power storage devices includes: a resin layer; a conductive layer containing copper and being disposed on the resin layer; and an active material layer containing graphite and being disposed on the conductive layer, wherein when measured by an X-ray diffraction method from a surface of the active material layer, a peak intensity ratio A/B between an intensity A at a highest X-ray diffraction peak in a range where a diffraction angle is 48° or more and 53° or less and an intensity B at a highest X-ray diffraction peak in a range where a diffraction angle is 52° or more and 57° or less satisfies Expression (1): 0.3≤A/B≤1 (1).

Electrode for power storage devices and lithium-ion secondary battery

A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.

Metal magnetic film and magnetic sheet

Disclosed is a noise suppression sheetincluding a resin layer, a non-magnetic metal layer, and a metal magnetic layerin this order.

Noise suppression sheet

One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces; wherein mounting parts of the first and second terminal electrodes formed on the mounting surface are joined to the board with the solder.

Electronic circuit module component

An electronic component module according to the present invention is provided with an electronic component, a sealing resin that seals the electronic component, and a metal film that covers a surface of the sealing resin. The sealing resin contains filler of oxide particles. Part of the filler in the sealing resin is exposed to the surface of the sealing resin. At least the part of the filler exposed to the surface of the sealing resin includes a crack that extends from an exposed surface of the filler into an inner portion. The crack is filled with at least one metal that constitutes the metal film.

Electronic component module

One aspect of an electronic component is an electronic component comprising an element body having a mounting surface and a plurality of side faces, the electronic component further comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, a metal film disposed on a surface of a mounting part of the first and second terminal electrodes formed on the mounting surface, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces.

Electronic component

A ceramic electronic componentincludes a ceramic bodyin which internal electrodes containing a metal component is buried, and a pair of terminal electrodesprovided to cover both end surfacesof the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodeshas a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body. The second electrode layer contains the metal component diffused from the internal electrodes.

Ceramic electronic component

A category setting part sets a type of a decoded image based on characteristics of the decoded image which are fineness of the decoded image and an intensity of movement of the decoded image. A code amount setting part sets a target code amount of an output image based on the type of the decoded image. A quantization step value setting part sets a quantization step value of the output image based on the target code amount of the output image. A transcoder can set the target code amount of the output image depending on fineness of the decoded image. The transcoder can distribute the target code amount of the output image to a reference image and a predicted image depending on the intensity of movement of the decoded image.

Transcoder

The present invention provides a terminal structureincluding a terminalhaving a conductorcontaining at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing NiP disposed on the first layer; and solderdisposed on the second layer of the terminal, while the second layer has a thickness of at least 0.35 &#x3bc;m; and a module substratehaving the terminal structure.

Terminal structure, printed wiring board, module substrate, and electronic device

The present invention provides a plating filmincluding a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3&#xd7;&#x3c3;&#xd7;100)/X is 10 or less, where X and &#x3c3; are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substratehaving the plating film

Plating film, printed wiring board, and module substrate

A varistorcomprises a varistor element, a pair of external electrodeson one main side of the varistor elementand a resistoron the same main side, wherein the resistoris formed so as to connect the pair of external electrodes. The varistor elementcontains zinc oxide as the main component and Ca oxides, Si oxides and rare earth metal oxides as accessory components, wherein the proportion X of the calcium oxides in terms of calcium atoms is 2-80 atomic percent with respect to 100 mol of the main component and the proportion Y of the silicon oxides in terms of silicon atoms is 1-40 atomic percent with respect to 100 mol of the main component, X/Y satisfying formula (1) below, and the external electrodes and resistor contain oxides other than bismuth oxide and copper oxide1&#x2266;&#x3c;3&#x2003;&#x2003;(1).

Varistor

A production method of a dielectric ceramic composition comprising a main component including a compound having a perovskite-type crystal structure expressed by a composition formula (BaCa) (TiZr)O(note that 0&#x2266;x&#x2266;0.2, 0&#x2266;y&#x2266;0.2), and a fourth subcomponent including an oxide of R (note that R is at least one selected from Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu); comprising steps of obtaining a post-reaction material by bringing a material of the main component to react in advance with a part of a material of the fourth subcomponent to be included in the dielectric ceramic composition, and adding rest of material of the fourth subcomponent to be included in the dielectric ceramic composition into the post-reaction material. According to the present invention, both of a dielectric ceramic composition capable of improving the specific permittivity and a temperature characteristic of capacitance can be preferable, and the production method can be provided.

Electronic device, dielectric ceramic composition and the production method

A transcoder calculates a reference conversion factor on the basis of a ratio between a total target bit rate of a whole second stream and an total input bit rate of a whole first stream and calculates a coefficient of variation from the total target bit rate of the whole second stream and an average output bit rate of a converted second stream in the N period. Next, a quantization step conversion factor in the next (N+1) period is calculated by adding the coefficient of variation to the reference conversion factor. Then, a quantization step value of a second stream in the (N+1) period is calculated by multiplying a quantization step value of a first stream in the (N+1) period by the quantization step conversion factor.

Transcoder controlling generated codes of an output stream to a target bit rate

A production method of a dielectric ceramic composition comprising a main component including barium titanate expressed by a composition formula of BaTiO, wherein 'm' satisfies 0.990&#x3c;m&#x3c;1.010, a fourth subcomponent including an oxide of R (note that R is at least one selected from Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu), and other subcomponent including at least BaO; comprising steps of preparing a post-reaction material by bringing a material of said main component to react in advance with at least a part of a material of said fourth subcomponent, wherein, when an amount of BaO included in said other subcomponent is n mole with respect to 100 moles of said main component, and said main component and said BaO are expressed by a composition formula of BaTiO, wherein 'm' and &#x201c;n&#x201d; satisfy 0.994&#x3c;m+n/100&#x3c;1.014; by which a dielectric ceramic composition capable of improving the specific permittivity without deteriorating the capacity-temperature characteristic, IR and IR accelerated lifetime, etc. and the production method can be provided.

Dielectric ceramic composition, electronic device and the production method

A production method of a dielectric ceramic composition comprising a main component including at least one selected from BaTiO, BaCaTiO, BaTiZrOand BaCaTiZrO, and a fourth subcomponent including rare earth oxide; comprising steps of dividing a material of the main component to a first main component material and a second main component material, obtaining a post-reaction material by making the material of the first main component react in advance with a part of the fourth subcomponent material, and adding the material of the second main component and rest of the fourth subcomponent material into the post-reaction material; wherein, when number of moles of the first main component is n1 and number of moles of the second main component is n2, a ratio is 0.5&#x2266;n1/(n1+n2)&#x2266;1: by which preferable characteristic can be obtained even when dielectric layers are made thin.

Growing community of inventors

Tokyo, Japan

Miyuki Yanagida