Shin-Etsu Chemical Co., Ltd.

Nippon Kayaku Kabushiki Kaisha

Miyuki Wakao

Toshio Shiobara

Tsutomu Kashiwagi

Kazuaki Sumita

Junichi Sawada

Yoshihiro Kawada

Kimitaka Kumagae

Chie Sasaki

Naofusa Miyagawa

Tsuyoshi Honda

Koji Futatsumori

Nobuhiro Ichiroku

Manabu Ueno

Naosuke Taniguchi

Kazutoshi Tomiyoshi

Hisashi Shimizu

Takayuki Aoki

Shoichi Osada

Yoshihira Hamamoto

Kazuhiro Arai

Masataka Nakanishi

Shigeki Ino

Kenichi Kuboki

Haruyoshi Kuwabara

Satoshi Okuse

Tadaharu Ikeda

Tomoyoshi Tada

Tatsuya Yamazaki

Kenichi Totsuka

A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C):

Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof

A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided. An epoxy resin represented by the following Formula (1): 

Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same

The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition. Disclosed is an epoxy resin represented by the following Formula (1): 

Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof

An epoxy resin represented by the following formula (1)  wherein Rrepresents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; Rrepresents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; Rrepresents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R, R, R, k, or m present in the formula may be the same or different from each other.

Silicone-modified epoxy resin and composition and cured article thereof

An addition-curable silicone resin composition includes (A-1) a linear organopolysiloxane having at least two alkenyl groups per molecule, (A-2) a terminal alkenyl group-containing branched organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane with a content of low-molecular-weight siloxane having a degree of polymerization of up to 10 and one or more terminal SiH group per molecule of 5 wt % or less, and (C) an addition reaction catalyst. The composition can be cured to form a product which, when used as a die attach material for optical semiconductor devices, minimizes contamination of the gold electrode pads on LED chips and imparts a good wire bondability.

Addition-curable silicone resin composition and die attach material for optical semiconductor device

A wavelength conversion sheet filled with a large amount of phosphor, enabling the phosphor to be easily dispersed uniformly and in a large amount near the surface of an LED element. Specifically, the sheet includes: a layer formed from a heat-curable resin composition, which contains 100 parts by mass of a resin component and 100 to 2,000 parts by mass of a particulate phosphor in which the proportion of particles having a sphericity of 0.7 to 1.0 is not less than 60% of all the particles, and which exists in a plastic solid or semisolid state in an uncured state at normal temperature, wherein the average particle diameter of the phosphor is not more than 60% of the thickness of the layer formed from the heat-curable resin composition, and the maximum particle diameter thereof is not more than 90% thereof.

Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device

The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

Epoxy composition for encapsulating an optical semiconductor element

A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below:

Resin composition for encapsulating optical semiconductor element

An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each Rrepresents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, Ris a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1&#x2266;a+b, and c represents an integer of 0 to 10 wherein, Rrepresents an alkylene group of 2 to 12 carbon atoms wherein, Rand Rare as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.

Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same

A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 &#x3bc;m, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.

Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device

An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 &mgr;m to 20 &mgr;m and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 &mgr;m and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.

Optical device-related adhesive and optical device

An epoxy resin composition comprising an epoxy resin, a first curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth reaction and crosslinking reaction of the epoxy resin optimizes the reaction conditions to B-stage, giving a semi-cured film having a minimized variation. A laminate includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

Epoxy resin composition, laminate film using the same, and semiconductor device

An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and finely divided silica, (D-ii) a hydrophilic polyoxyalkylene-modified silicone oil, and optionally, (D-iii) a polyoxyalkylene polymer. The epoxy resin composition has the advantages of improved infiltration to semiconductor device-substrate gaps and minimized formation of internal and surface voids.

Epoxy resin composition

Blended in a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler are a specific imidazole compound as a curing accelerator and an amino group-containing, polyether-modified polysiloxane. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device

An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of up to 1.7, an inorganic filler, a curing catalyst, a thermoplastic resin, and an optional phenolic resin and having a Tg of lower than 15&deg; C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. Owing to the thermoplastic resin added, the composition avoids the problem that when a semiconductor chip is sealed with an uncured film of the composition, the film will lose its original shape or entrapped voids will be formed near the chip.

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Annaka, Japan

Miyuki Wakao