Denki Kagaku Kogyo Kabushiki Kaisha

Miyuki Nakamura

Yasuhito Fushii

Akira Miyai

Yukihiko Nakajima

Yoshihiko Tsujimura

Kazuo Kato

Kazuyuki Hiruta

An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.

Substrate

Method for forming a ceramic circuit board by forming a metal circuit pattern on a ceramic board through an active metal ingredient-containing brazing material and removing an unnecessary part of the brazing material by chemical liquor treatment.

Method for forming a ceramic circuit board

Growing community of inventors

Omuta, Japan

Miyuki Nakamura