Matsushita Electric Industrial Co., Ltd.

Miyuki Nagaoka

Takaaki Higashida

Daisuke Suetsugu

Kenichi Yamamoto

Takashi Imanaka

Toshinari Nitta

Nobuyuki Kume

Harumi Yoshino

A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land. The first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.

Electronic circuit connecting structure, and its connecting method

A pair of laminated metallized films is convolutely wound into a roll. The metallized area of each dielectric film is segmented into a plurality of longitudinally spaced apart metallized areas which are connected together to an electrode. The separation between successive metallized areas is in a range from 0.1 mm to 5.0 mm and the interval between successive separations is from 10 mm to 500 mm to assure a 100% guaranty. A first of the metallized areas extends transversely from a first non-metallized marginal area to the opposite edge of a first dielectric film. A second of the metallized areas extends transversely from the second non-metallized marginal area to the opposite edge of a second dielectric film. First and second electrodes are respectively connected to edges of the first and second metallized areas.

Roll type capacitor having segmented metallized areas

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Hirata, Japan

Miyuki Nagaoka