Murata Manufacturing Co., Ltd.

Miyuki Mizukami

Katsunori Ogata

Mamoru Ogawa

Naohiro Yamada

Tatsuya Todo

A multilayer ceramic electronic component includes a component body, a first external electrode provided on a first end surface of the component body, and a second external electrode provided on a second end surface of the component body. An absolute value of a difference between a surface roughness of a first side surface and a surface roughness of a second side surface of the component body is smaller than an absolute value of a difference between a surface roughness of a first main surface and a surface roughness of a second main surface.

Multilayer ceramic electronic component, and method of manufacturing multilayer ceramic electronic component

An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.

Electronic component manufacturing apparatus and electronic component manufacturing method

In an expanding device that can more effectively expand an adhesive tape in its wafer-attached region and can pick up components on the adhesive tape with high accuracy, a central first portion of an adhesive tape, including a portion with a wafer attached thereto, is laid on a top surface of a heating table, a non-heated ring is disposed to surround an outer peripheral edge of the heating table, a heat insulation is laid on an upper surface of the non-heated ring, a second portion of the adhesive tape located outwardly of the first portion thereof is located on or above the insulation, a third portion of the adhesive tape located outwardly of the second portion is held by a holder, and the holder is movable up and down relative to the heating table and the non-heated ring by a drive unit.

Expanding device and method for manufacturing components

An electronic component manufacturing apparatus includes a first plate and a second plate such that a first surface of an electronic component chip is in contact with a first elastic layer of the first plate and a second surface of the electronic component chip is in contact with a second elastic layer of the second plate. The electronic component manufacturing apparatus further includes a planar movement mechanism configured to relatively move the first and second plates in a planar direction thereof and a vertical movement mechanism configured to move, in conjunction with the planar movement mechanism, the first and second plates in accordance with a turning path of the electronic component chip.

Electronic component manufacturing apparatus with opposing plates for holding electronic component during movement

In order to suppress deviation of conductor films and to effectively remove voids when a laminate obtained by stacking a plurality of ceramic green sheets provided with the conductor films is pressed in the direction of stacking, a pressing step is divided into a preliminary pressing step and a main pressing step which is carried out subsequently thereto. In the preliminary pressing step, a temperature of at least 40.degree. C. is applied to the laminate of the plurality of ceramic green sheets by a heater, while a press head is driven toward the laminate, thereby applying a pressure of not more than 50 kgf/cm.sup.2 to the same. The preliminary pressing step may be further divided into first and second preliminary pressing steps. In the first preliminary pressing step, the laminate is pressed by a press surface having projections on regions corresponding to those provided with the conductor films, so that voids are removed from the regions provided with the conductor films. In the second preliminary step, the laminate is pressed by a press surface having projections on regions corresponding to those provided with no conductor films, so that at least the regions provided with no conductor films are pressed.

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Nagaokakyo, Japan

Miyuki Mizukami