Sony Semiconductor Solutions Corporation

Sony Corporation

Miyoshi Togawa

Hirokazu Nakayama

Yuta Momiuchi

Ryo Itotani

Tooru Kai

Yuji Takaoka

Hirokazu Seki

Kiyohisa Tanaka

Eiichirou Kishida

The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.

Camera module, production method, and electronic device

To more securely hold reliability of an electronic component. There is provided an electronic component including a base material having a main face, at least one wiring formed on the main face of the base material, at least one pad provided at each end of the at least one wiring on the main face of the base material, a resist part formed to cover the at least one wiring on the main face of the base material, and a chip flip-chip mounted on the main face of the base material and connected to the base material via a bump bonded to the at least one pad, in which the resist part has a pad opening configured to expose the at least one pad bonded with the bump, and a circulation groove formed to be connected to the pad opening at one end as a connection end to the pad opening.

Electronic component and camera module

To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.

To enable a structure to be downsized, and to restrict a reduction in image quality. There is provided an electronic component including a circuit board having a first face, a second face opposite to the first face, and a first opening, a translucent member provide to oppose the first face of the circuit board, an imaging device flip-chip mounted on the second face of the circuit board and having a light receiving face on a side opposing the translucent member, and a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board.

Electronic component, camera module, and method for manufacturing electronic component

The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.

Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients

A lead frame comprises a lead frame body having cut-away portions cut away from the side surfaces of the lead frame body, a die pad for securing a semiconductor chip, bonding electrodes surrounding the die pad, external electrodes for allowing the lead frame to be mounted, wiring for surface treatment extending on the lead frame body with its end being located at a portion of each of the side surfaces of the lead frame body, the portion being opposed to the cut-away portions. The bonding electrode and the wiring for surface treatment, as well as the external electrode and the wiring for surface treatment, are electrically connected, respectively. Even when the lead frame is electrostatically charged by friction with a transfer unit, the semiconductor chip on the lead frame avoids electrostatic damage.

Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body

Disclosed is a semiconductor device for improving a resistance against barrel cracks of an insulating substrate on which a semiconductor chip is mounted, thereby enhancing a reliability of the semiconductor device. A plurality of through-holes provided in a BGA substrate for electrically connecting electrodes of a semiconductor chip to packaging electrodes are arranged inside a region of the BGA substrate in which the semiconductor chip is mounted. When the semiconductor device undergoes temperature changes, a larger extension/contraction force is applied to the lower portion of the BGA substrate as compared with the upper portion thereof, and such an expansion/contraction force becomes larger at a position more apart from the center of the BGA substrate. As a result, a through-hole at a position more apart from the BGA substrate is applied to a larger stress. However, since the plurality of through-holes are arranged inside the region of the BGA substrate in which the semiconductor chip is mounted, the stress applied to each through-hole can be reduced. This is effective to suppress occurrence of barrel cracks.

Growing community of inventors

Oita, Japan

Miyoshi Togawa