Hitachi, Ltd.

Renesas Technology Corp.

Other

Miwako Nakahara

Sukeyoshi Tsunekawa

Shigeru Ohno

Takashi Yunogami

Toshiyuki Arai

Kazuto Watanabe

Kiyoshi Ogata

Kazuhiko Horikoshi

Ryoji Oritsuki

Takuo Tamura

Yasushi Nakano

Takeo Shiba

Makoto Ohkura

Toshihiko Itoga

Takahiro Kamo

Eisuke Nishitani

Tadanori Yoshida

Naoki Kanda

Arito Ogawa

Klyoshi Ogata

Yoshitaka Nakamura

Masaru Izawa

Kazuo Nojiri

Tomonori Saeki

Ruthenium, osmium and their oxides can be etched simply and rapidly by supplying an atomic oxygen-donating gas, typically ozone, to the aforementioned metals and their oxides through catalysis between the metals and their oxides, and the ozone without any damages to wafers and reactors and application of the catalysis not only to the etching but also to chamber cleaning ensures stable operation of reactors and production of high quality devices.

Process for treating solid surface and substrate surface

When polycrystalline silicon germanium film is used for gate electrodes in a MOS transistor apparatus, there have been problems of reduced reliability in the gate insulating film, due to stress in the silicon germanium grains. Therefore, a polysilicon germanium film is formed, after forming silicon fine particles of particle size 10 nm or less on an oxide film. As a result, it is possible to achieve a high-speed MOS transistor apparatus using an ultra-thin oxide film having a film thickness of 1.5 nm or less, wherein the Ge concentration of the polycrystalline silicon germanium at its interface with the oxide film is uniform, thereby reducing the stress in the film, and improving the reliability of the gate electrode.

MOS transistor apparatus and method of manufacturing same

Inexpensive, unannealed glass is used as a substrate. The surface of a polycrystalline silicon film doped with boron (B) or phosphorus (P) is oxidized with ozone at a processing temperature of 500&#xb0; C. or below to form a silicon oxide film of 4 to 20 nm thick on the surface of polycrystalline silicon. On account of this treatment, the level density at the interface between the gate-insulating layer and the channel layer can be made lower, and a thin-film transistor having less variations of characteristics can be formed on the unannealed glass substrate.

Process for manufacturing thin film transistor on unannealed glass substrate

To a polycrystalline silicon layer crystallized by irradiation with laser light, a mixed gas comprised of ozone gas and H O or N O gas is fed at a processing temperature of 500&deg; C. or below, or the polycrystalline silicon layer is previously treated with a solution such as ozone water or an aqueous NH /hydrogen peroxide solution, followed by oxidation treatment with ozone, to form a silicon oxide layer with a thickness of 4 nm or more at the surface of the polycrystalline silicon layer for forming a thin-film transistor having characteristics that are less varying on a glass substrate previously not annealed.

Thin-film transistor and method of manufacturing the same

To a polycrystalline silicon layer crystallized by irradiation with laser light, a mixed gas comprised of ozone gas and H O or N O gas is fed at a processing temperature of 500&deg; C. or below, or the polycrystalline silicon layer is previously treated with a solution such as ozone water or an aqueous NH /hydrogen peroxide solution, followed by oxidation treatment with ozone, to form a silicon oxide layer of 4 nm or more thick at the surface of the polycrystalline silicon layer for forming a thin-film transistor having less variations of characteristics on an unannealed glass substrate.

Process of manufacturing a thin-film transistor

A pretreatment in which impurities containing carbon are removed from a conductor film formed on a substrate is performed prior to an etching treatment of the conductor film. In this pretreatment, a gas containing oxygen, nitrogen, or a nitrogen oxide is irradiated with ultraviolet rays or electromagnetic waves, and this gas is supplied to the substrate surface, which has been heated to a temperature of 200&deg; C. or lower. This allows a semiconductor device having at least one type of conductor film selected from among a ruthenium film, a ruthenium oxide film, an osmium film, and an osmium oxide film to be manufactured inexpensively and at a high level of quality.

Method for manufacturing semiconductor device having an etching treatment

Ruthenium, osmium and their oxides can be etched simply and rapidly by supplying an atomic oxygen-donating gas, typically ozone, to the aforementioned metals and their oxides through catalysis between the metals and their reactors and application of the catalysis not only to the etching but also to chamber cleaning ensures stable operation of reactors and production of high quality devices.

With a view to providing a technique for highly-selective etching of Ru (ruthenium) using a photoresist as an etching mask, an Ru-film, which is an lower electrode material deposited on the side walls and bottom surface of a hole, is covered with a photoresist film, followed by isotropic dry etching in a gas atmosphere containing an ozone gas, whereby a portion of the Ru film outside of the hole is removed.

Manufacturing method of semiconductor integrated circuit device

Inexpensive, unannealed glass is used as a substrate. The surface of a polycrystalline silicon film doped with boron (B) or phosphorus (P) is oxidized with ozone at a processing temperature of 500&deg; C. or below to form a silicon oxide film of 4 to 20 nm thick on the surface of polycrystalline silicon. On account of this treatment, the level density at the interface between the gate-insulating layer and the channel layer can be made lower, and a thin-film transistor having less variations of characteristics can be formed on the unannealed glass substrate.

Growing community of inventors

Yokohama, Japan

Miwako Nakahara