Panasonic Corporation

Miwa Ichiryu

Hidetoshi Nishimura

Hiroyuki Uehara

Toshiyuki Moriwaki

Tetsurou Toubou

A first wiring () has a bending portion (), a first wiring region () extending from the bending portion () in the X direction, and a second wiring region () extending from the bending portion () in the Y direction. A via () is formed under the wiring (). The via () is formed so as not to overlap with a region of the bending portion () in the first wiring region (). The length of the via () in the X direction (x) is longer than the length thereof in the Y direction (y) and both ends of the via () in the Y direction overlap with both ends of the first wiring region () in the Y direction.

Semiconductor device including a first wiring having a bending portion a via

Semiconductor device including a first wiring having a bending portion and a via including the bending portion

A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to 'a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area.

Growing community of inventors

Osaka, Japan

Miwa Ichiryu