Hitachi, Ltd.

Mituo Katou

Kazuya Takahashi

Ryoichi Kajiwara

Kunihiro Tsubosaki

Masatoshi Watanabe

Katuo Sugawara

Minoru Yamada

Takao Funamoto

Keiichirou Nakanishi

Tomohiko Shida

Hiroshi Wachi

Tokiyuki Seto

Takeshi Matsuzaka

Minoru Maruta

An ultrasonic bonding apparatus comprises an ultrasonic wave controller, a bonding system including a bonding head, a laser oscillator, a laser optics, a vibration monitoring system including a vibrometer, and a mechanism for feeding a result of monitoring back to a bonding condition.

Ultrasonic bonding apparatus and quality monitoring method

An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.

Integrated circuit device

Growing community of inventors

Hitachiota, Japan

Mituo Katou