Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Mitsuyoshi Nishino

Kiyotaka Komori

Takashi Matsuda

Toshiyuki Asahi

Yoshihiko Nakamura

Tatsuya Arisawa

Naoyuki Tani

Yoshito Kitagawa

Akiyoshi Nozue

Takayuki Suzue

Tomoyuki Abe

Daisuke Nii

Shun Yamaguchi

Akira Irifune

Syouji Hasimoto

Fuminori Satou

Fuminori Sato

Kentaro Fujino

A metal-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by Formula (1) in a molecule and a metal foil that is laminated on the insulating layer and is a metal foil in which a nickel element amount on a surface on a side in contact with the insulating layer and a nickel element amount on the surface when the surface is sputtered for 1 minute at 3 nm/min in terms of SiOare each 4.5 at % or less with respect to the total element amount on each surface. In Formula (1), Z represents an arylene group, R-Reach independently represent a hydrogen atom or an alkyl group, and R-Reach independently represent a hydrogen atom or an alkyl group having 1-6 carbon atoms.

Metal-clad laminate, wiring board, resin-including metal foil, and resin composition

A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.

Resin composition, prepreg and laminate board

A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m/g to 15 m/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board

A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D) of 2 to 15 &#x3bc;m and (B) magnesium oxide having an average particle diameter (D) of 0.5 to 15 &#x3bc;m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

Prepreg, laminate, metal foil-clad laminate, circuit board and LED module

Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D) of 1 to 15 &#x3bc;m; (B) aluminum oxide particles having an average particle size (D) of 1.5 &#x3bc;m or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board

Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D) of 2 to 15 &#x3bc;m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D) of 2 to 15 &#x3bc;m and inorganic particles that have an average particle diameter (D) of 2 to 15 &#x3bc;m and that contain crystal water having a release initiation temperature of 400&#xb0; C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D) of 1.5 &#x3bc;m or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting

Growing community of inventors

Fukushima, Japan

Mitsuyoshi Nishino