Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Mitsuyoshi Nishide

Norio Sakai

Yoshihito Otsubo

Shinichiro Banba

Hiroji Tani

Akira Baba

Isao Kato

Masato Nomiya

Tomohiro Kato

Noboru Kato

Satoshi Ishino

Jun Urakawa

Hirofumi Sunahara

Haruhiko Mori

Kazuo Kishida

Kazuhito Ohshita

Takayuki Nagano

Ryoji Nakamura

Tatsuya Hosotani

Hiroshi Takagi

Masahiro Ozawa

Hiromichi Kawakami

Sadaaki Sakamoto

Tsuyoshi Katsube

Kenji Kubota

Tatsuyuki Yamada

Kiyokazu Yamada

Masaaki Mizushiro

Junji Kurobe

Tomonori Ito

Norio Yoshida

Yosuke Tomoshige

Masaaki Hanao

Koji Ryugo

Tetsuya Kanagawa

Yukinobu Sato

Isao Tamaki

Atsuko Omori

Nobuyuki Suzuki

A wireless rechargeable solid-state battery module includes a solid-state battery; an internal structure including an internal circuit electrically connected with the battery; positive and negative electrode terminals, each of which is electrically connected with the solid-state battery, is exposed on an outer surface, and is where the positive or negative electrode terminal can be mounted on an electronic circuit board; barrier layers that entirely or partially contain a conductor and isolate the battery and the internal structure from an outside air environment; and a power receiving terminal electrically connected with an external circuit, which includes a power receiving coil coupled with an external electromagnetic or magnetic field, is electrically connected with the internal circuit, and is in an outside of the barrier layers. The power receiving coil converts the external electromagnetic or magnetic field into electrical energy and supplies current to the internal circuit via the power receiving terminal.

Wireless rechargeable solid-state battery module and wireless power supply module

A battery that includes a substrate, a solid-state battery on the substrate, and a circuit for the solid-state battery on the substrate.

Solid-state battery

A solid-state battery including a solid-state battery laminate having a positive electrode layer, a negative electrode layer, and a solid electrolyte layer interposed between the positive electrode layer and the negative electrode layer, each of the positive electrode layer and the negative electrode layer having an electrode active material. A first active material contour portion in which the electrode active material in one of the positive electrode layer and the negative electrode layer extends to a first plan-view contour of the solid-state battery laminate, and a first non-active material contour portion in which the electrode active material in the other of the positive electrode layer and the negative electrode layer does not extend to the first plan-view contour of the solid-state battery laminate face each other in a lamination direction.

A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer.

A coil electrode of a coil component includes a plurality of lower wiring patterns arranged on a lower surface of an insulating layer; a plurality of upper wiring patterns arranged on an upper surface of the insulating layer; a plurality of inner conductors disposed at an inner peripheral side of the coil core, each inner conductor connecting one end of the corresponding one of the lower wiring patterns and one end of a corresponding one of the upper wiring patterns forming the pair with the lower wiring pattern; and a plurality of outer conductors disposed at an outer peripheral side of the coil core, each outer conductor connecting the other end of the corresponding one of the lower wiring patterns and the other end of the corresponding one of the upper wiring patterns adjacent to an upper wiring pattern forming the pair with the lower wiring pattern.

Coil component

A surface mount coil component includes an element body defining a compact including magnetic material particles; a coil that is buried, excluding an end portion of the coil, in the element body; and an input-output terminal electrically connected to the end portion of the coil. A thermoplastic resin layer is provided on a surface on a mounting surface side of the element body. An interlayer connection conductor is provided in the thermoplastic resin layer. The input-output terminal is provided on a surface of the thermoplastic resin layer and is electrically connected to the end portion of the coil via the interlayer connection conductor.

Surface mount coil component and manufacturing method for the same, and DC-DC converter

A surface mount coil component includes an element body with a first surface, a second surface that opposes the first surface, and a third surface connecting the first surface and the second surface, the element body being defined by a compact including magnetic particles; a first conductor pattern provided at the first surface of the element body; a second conductor pattern provided at the second surface of the element body; input/output terminals provided at the third surface of the element body; and metal pins embedded in the element body, ends of each metal pin being connected to the first and second conductor patterns. The first conductor pattern, the second conductor pattern, and the metal pins define a coil conductor. The input/output terminals are defined by a pair of metal pins exposed at the third surface.

Surface mount coil component, method of manufacturing the same, and DC-DC converter using the same

An inductor componentincludes a resin layer, a protective film, two metal pinsprovided to stand in the resin layer, and a metal platejoined to both of the metal pins, and both of the metal pinsand the metal plateconfigure an inductor electrode. Both of the metal pinsare provided to stand in the resin layer, upper end surfacesthereof are exposed to an upper surfaceof the resin layer, and lower end surfacesthereof are exposed to a lower surface. Recessesare formed around the peripheral edges of the upper end surfacesof both of the metal pinsby laser beam irradiation.

Inductor component and method for manufacturing inductor component

An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.

Inductor component manufacturing method and inductor component

A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.

Inductor component

Substrate-side wiring electrode patterns, which form a part of a coil electrode, are provided on a wiring substrate, and as a result reductions in the size and profile of a resin insulating layer, in which a coil coreis buried, can be achieved. Therefore, reductions in the size and the profile of a coil modulecan be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns, which form a part of the coil electrode, are provided on the wiring substrate, the heat generated by a coilcan be efficiently released from the substrate-side wiring electrode patternsto the wiring substrate. Therefore, the heat dissipation property of the coil modulecan be improved at low cost.

Coil module

An inductor component including an inductor electrode includes an insulating layer and an outer electrode for external connection formed on the upper surface of the insulating layer. The inductor electrode includes a metal pin for input/output that has an upper end surface connected to the outer electrode and that is embedded in the insulating layer. The outer electrode includes a base electrode formed on the upper surface of the insulating layer and composed of a conductive paste, and a surface electrode formed on the base electrode by plating. The surface electrode is formed such that the area of a cross section thereof perpendicular to the thickness direction on an outer layer side away from the base electrode is larger than the area of a cross section thereof perpendicular to the thickness direction on an inner layer side close to the base electrode.

An inductor device () includes a magnetic body () and a conductor buried in the magnetic body (), and the conductor includes first conductors () as metal pins. The magnetic body () is formed into a flat plate shape with a first main surface and a second main surface each having a predetermined shape, which oppose each other, and side surfaces connecting the first main surface and the second main surface. The conductor includes the first conductors () one end portions of which are exposed to the second main surface of the magnetic body () and a second conductor () which is connected to the other end portions of the first conductors ().

Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device

A module includes: an insulating layer; an annular coil core in the insulating layer; a coil electrode having outer metal pins arranged along an outer circumferential surface of the coil core, inner metal pins arranged along an inner circumferential surface of the coil core to form pairs with corresponding outer metal pins, bonding wires, each connecting one end surface of each outer metal pin and inner metal pin that form a pair, and wiring electrode patterns, each connecting another end surface of each outer metal pin to another end surface of an inner metal pin adjacent in a predetermined direction to the inner metal pin that forms a pair with the outer metal pin; and a buffer layer, formed from a non-conductive material having a lower elastic modulus than the insulating layer, that covers the surface of the coil core.

Module

An inductor componentincludes a resin layerand an inductor electrode. The inductor electrodeincludes metal pinstothat extend in the resin layerwith end facestoof the metal pinstoexposed from an upper surfaceof the resin layer, and upper wiring platesandthat are disposed on the upper surfaceof the resin layerand that connect the end facesandof the short metal pinsandand the end facesandof the long metal pinsandto each other. In this case, the inductor electrodeis formed of the metal pinstoand the wiring platestothat each have a specific electrical resistance lower than that of a conductive paste and plating.

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Shiga-ken, Japan

Mitsuyoshi Nishide