Tdk Corporation

Fujifilm Corporation

Mitsuyoshi Kawai

Masashi Shiraishi

Takeshi Wada

Takashi Honda

Norikazu Ota

Takao Matsumoto

Atsushi Hirose

Makoto Yoshida

Haruyuki Morita

Yoshikazu Soeno

Katsumichi Tagami

Tomonaga Nishikawa

Kazuhiko Maejima

Hiroshi Kamiyama

Hiroki Matsukuma

Takamitsu Tsuna

Shinji Ichikawa

Izumi Nomura

Tsutomu Chikamatsu

A thin-film magnetic head where the closure is bonded with sufficiently high adhesive strength by the adhesive layer thinner than conventional and that is free from the problem of fine dusts, is provided. The head comprises: a substrate having an element-formed surface and an opposed-to-medium surface; at least one magnetic head element provided on/above the element-formed surface; an overcoat layer formed on the element-formed surface; an etching pattern formed on a part of an upper surface of the overcoat layer, the whole or a part of the etching pattern being filled up by adhesive; a closure provided on the etching pattern of the overcoat layer; and an opening portion formed close to an edge on the opposite side to the opposed-to-medium surface of an adhesive surface of the closure, being a portion exposed from the closure of the etching pattern.

Thin-film magnetic head with closure and manufacturing method of the head

A thin-film magnetic head that shows stable read and/or write performances, maintaining the reliability over time by suppressing the wear of the head sufficiently, is provided. The head comprises: a substrate having an element-formed surface and an opposed-to-medium surface; a magnetic head element; an overcoat layer formed on the element-formed surface so as to cover the magnetic head element; a closure provided on the overcoat layer, a surface of the closure being in contact with the upper surface of the overcoat layer; and an element contact pad formed in a sliding-side surface of the head and having a contact surface including a part of the opposed-to-medium surface, a part of an end surface of the overcoat layer and a part of an end surface of the closure, one end of the magnetic head element reaching the contact surface.

Thin-film magnetic head comprising contact pad including portions of closure and substrate and magnetic recording apparatus comprising the head

A HGA includes a magnetic head slider having at least one thin-film magnetic head element, an IC chip having a circuit for the at least one thin-film magnetic head element, and a suspension for supporting the magnetic head slider and the IC chip. All surfaces of the IC chip are coated by additional insulation layers.

Head gimbal assembly having an encased drive IC chip

A HSA includes a magnetic head slider with at least one thin-film magnetic head element, an actuator fixed to the magnetic head slider for performing precise positioning of the at least one thin-film magnetic head element, an IC chip having a first circuit for the thin-film magnetic head element and a second circuit for driving the actuator, and a suspension for supporting the actuator and the IC chip.

Head suspension assembly with a precise positioning micro-cap actuator composed of a piezoelectric material

A magnetic head apparatus including a magnetic head slider having at least one thin film magnetic head element, a suspension mounting the magnetic head slider on one face thereof, an IC chip mounted with a circuit for the thin film magnetic head element and a support arm fixedly supporting the suspension in which the IC chip is mounted on the one face of the suspension and is thermally coupled to the support arm.

Magnetic head apparatus with IC chip mounted on suspension for increased heat diffusion and magnetic disk apparatus having magnetic head apparatus

A method of manufacturing a head suspension assembly includes attaching underfill to a portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted, disposing the IC chip on the attached underfill, and performing ultrasonic bonding of the IC chip.

Manufacturing method of head suspension assembly with IC chip

A head suspension assembly includes a magnetic head slider with at least one thin-film magnetic head element, a head IC chip with a circuit for the at least one thin-film magnetic head element, and a support member for supporting the magnetic head slider and the head IC chip. The support member has a recess portion for reducing a protruded height of the head IC chip at a position for mounting the head IC chip.

Head suspension assembly with IC chip

A method of mounting an IC chip on a suspension having connection pads. The IC chip has a circuit for a thin-film magnetic head element and connection terminals connected to the circuit. The method includes a step of increasing a load applied to the IC chip so that metal bumps formed on the connection terminals press the connection pads formed on the suspension, respectively, and a step of starting application of the ultrasonic vibration to the IC chip during the increasing of the load applied to the IC chip.

Mounting method of IC chip and manufacturing method of head suspension assembly with the IC chip

A head suspension assembly includes a magnetic head slider with at least one thin-film magnetic head element, an actuator fixed to the magnetic head slider for performing precise positioning of the at least one thin-film magnetic head element, a support member for supporting the actuator, a flexible first lead conductor member with one end electrically connected to the at least one thin-film magnetic head element, at least part of the first lead conductor member being formed on the support member, and a second lead conductor member with one end electrically connected to the actuator. At least part of the second lead conductor member is formed on the support member. The support member has a first portion on which the one end of the first lead conductor member is formed and a second portion. The first portion is individually separated from the second portion.

Head suspension assembly with flexible air-floating lead

The object of the invention is to provide a write/read head supporting mechanism for a magnetic or optical disk system having a micro-displacement actuator, by which any impediment to the displacement capability of the actuator is eliminated to achieve reliability improvements. The write/read head supporting mechanism comprises a slider, a suspension and an actuator as at least head constituents. The slider is provided with an electromagnetic transducer element or an optical module. The slider supported on the suspension by way of the actuator is displaceable relatively with respect to the suspension by the actuator. Between relatively displacing head constituents there is a space. Preferably, friction-reducing means should be provided in the space.

Write/read head supporting mechanism, and write/read system

There is disclosed a magnetic head device in which a head IC chip may be located relatively closer to a magnetic head and a thermal effect may be controlled to be within a range of acceptable degree. Said magnetic head device comprises a head slider having a magnetic head, a suspension member which is made of thin resilient material and supports the head slider at one end thereof, and a head IC chip, wherein the suspension member is attached to other member at the other end thereof. The IC chip is mounted on the suspension member. When the IC chip is selected to have appropriate disc side area and is mounted on the suspension member, the temperature of the IC chip itself may be maintained within a range of acceptable degree and that of the magnetic head may be also kept to be lower. When the electric power consumption of the IC chip is equal to or less than 410 mW, the disc side area thereof should be equal to or more than 1.1 mm . The IC chip is mounted on a surface of the suspension member at a side facing to the disc at a position where a relative linear velocity equal to or more than 25 m/sec is generated with respect to said disc.

Growing community of inventors

Tokyo, Japan

Mitsuyoshi Kawai