Koki Company Limited

Origin Company, Limited

Mitsuyasu Furusawa

Kazuhiro Yukikata

Takayuki Suzuki

Naoto Ozawa

Junichi Aoki

Arisa Shiraishi

Satoshi Ootani

Kimiaki Mori

Yuki Yamamoto

Kenji Arai

Yuusuke Sato

Takeshi Shirai

Noriyoshi Uchida

Koichi Sekiguchi

Tatsuya Baba

Takeshi Yahagi

Yukiko Hayashi

Mayumi Takada

Munehiko Nakatsuma

Yusuke Satoh

The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.

Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package

A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.

Flux, solder paste, and method for producing electric circuit board

A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure Plower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure Plower than the first pressure P.

Method for producing joined structure

Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.

Resin composition for reinforcement and electronic component device

Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.

Solder paste using a solder paste flux and solder powder

Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.

Solder alloy and resin flux cored solder

Provided is a flux activator containing a halogen compound represented by formula 1 below: 

Flux activator, flux, and solder

The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

Solder paste for reduction gas, and method for producing soldered product

Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.

Growing community of inventors

Tokyo, Japan

Mitsuyasu Furusawa