Daiso Co., Ltd.

Mitsutoshi Yoshinobu

Mikio Sugahara

Yoshiyuki Tanaka

Disclosed is a laminate comprising a thermosetting resin-impregnated prepreg layer (A) constituting a surface layer, a rubber or thermoplastic resin layer (B) having a flexibility and a hot melt resin adhesive layer (C), the thermosetting resin-impregnated prepreg layer and rubber or thermoplastic resin layer being heat bonded through the hot melt resin adhesive layer. The layer (A) is a prepreg impregnated with a thermosetting resin selected from a diallyl phthalate resin, an unsaturated polyester, a phenol resin, an aminoalkyd resin, an epoxy resin, an acrylurethane resin and a melamine resin. The rubber or resin of the layer (B) is a rubber or a thermoplastic resin selected from chlorinated polyethylene, polybutene, ethylene-vinyl acetate copolymer, an ethylene-propylene-diene copolymer, a chloroprene polymer, chlorosulfonated polyethylene, a styrene-butadiene copolymer and polyvinyl chloride. In addition, the hot melt resin of the layer (C) is a hot melt resin having a melting point of 60.degree. to 165.degree. C. and a solubility parameter (SP value) of 7.4 to 10.9, selected from an ethylene-vinyl acetate copolymer an ethylene-acrylic acid copolymer, carboxylated polyethylene, polyurethane, polybutylene terephthalate and a modified ethylene-vinyl acetate copolymer.

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Amagasaki, Japan

Mitsutoshi Yoshinobu