Semitec Corporation

Mitsutoshi Ogura

Provided are an electronic component, a lead part connection structure, and a lead part connection method which can reduce damage of a lead part and improve joint strength. In this lead part connection structure, a lead part () made of a conductor and a conductive wire () made of a plurality of core wires () are connected to each other through welding, wherein the lead part () and the conductive wire () are connected to each other through welding in a condition in which the lead part () is fitted into the plurality of core wires () of the conductive wire (). In the conductive wire (), the core wires () are not integrated with each other in advance through welding.

Electronic component, lead part connection structure, and lead part connection method

A temperature sensor and a device are provided, in which the temperature sensor is capable of reducing thickness, increasing a contact area with an object whose temperature is to be measured, and improving measurement accuracy. A temperature sensor is provided with: a thermistor element; a lead-out wire connected to the thermistor element; a lead wire connected to the lead-out wire; an inner layer formed by heating and curing or by melting and solidifying a pair of sheet-like inner layer materials formed of a resin material; and outer layers formed of a pair of sheet-like outer layer materials formed of a resin material and having flat surfaces on both sides. The thermistor element, the lead-out wire, and a connection part between the lead-out wire and the lead wire are covered with the inner layer, and are also covered with the pair of outer layers by being sandwiched therebetween.

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Tokyo, Japan

Mitsutoshi Ogura