Denso Corporation

Mitsutoshi Miyazaki

Masayoshi Fujita

Naoto Iwata

Toshihiro Miyake

Yoshitaro Yazaki

Makoto Totani

Yosiyasu Andou

Koichiro Sato

Kunihiro Kodama

Hideyuki Suzuki

Kazuyuki Deguchi

Nobuhiko Nagai

Akinari Higashida

Toshiji Kondou

Hiroaki Maeda

Hiroki Miyagawa

Yoshiaki Mizuno

Masahiko Natume

A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.

Method for connecting printed circuit boards and connected printed circuit boards

An improved method of machining slots and material feed holes in a molding die such as an extrusion die designed to form a honeycomb structure of ceramics employed as a catalyst carrier of a catalytic converter for automotive vehicles. In one of the preferred embodiments, shallow holes are drilled in a die material and subjected to electrochemical machining to remove material from the bottoms of the shallow holes so that they communicate with the material feed holes without any burrs. In the other embodiment, the slots are cut using a rotary cutter in a given order which will balance reaction forces exerted on the cutter from both side walls of each slot to minimize deformation of the cutter during cutting of the slots, thereby preventing the slots from being curved undesirably.

Method for machining slots in molding die

A method of attaching a mold releasing agent to a molding die, a molding apparatus and a molding die therefor are disclosed. A fixed die ( ) of the molding die ( ) is connected to the nozzle receiving surface of a molding cavity ( ) facing a material supplying nozzle. The mold releasing agent is attached to the material contacting surface ( ) of the molding die ( ) in such a manner that the fixed die ( ) and a movable die ( ) are arranged in opposed relation to each other with a gap therebetween less than a distance which allows release of a molded product, and under this condition, the mold releasing agent is supplied to the material contacting surface ( ) through the gap between the material supplying nozzle ( ) and the nozzle receiving surface ( ).

Method of attaching mold releasing agent to molding die, molding apparatus and molding die

A metal mold for molding a hexagonal honeycomb structure, having feed holes for feeding a material, pool grooves formed in the shape of a triangular lattice and communicated with the feed holes, and slit grooves formed in the shape of a hexagonal lattice and communicated with the pool grooves. Each hexagonal lattice of the slit grooves is so formed as to come into agreement with a hexagon shaped by combining six triangular lattices of the pool grooves.

Metal mold for molding a honeycomb structure

Growing community of inventors

Nagoya, Japan

Mitsutoshi Miyazaki