Sumitomo Electric Industries, Limited

Mitsutoshi Kamakura

Hisao Go

Osamu Akita

Kazuhiro Tanida

Akihiko Shioda

Yoshihide Enami

Hiroyuki Ishii

Masayuki Nishikawa

Kouichi Andou

Hiroichi Murakami

Yasunori Mititsuji

Optoelectronic properties of optical communication LEDs, LDs and PDs should be examined in a wide range of temperatures between &#x2212;40&#xb0; C. and +85&#xb0; C. Low temperature photocharacteristics of as-chip devices are tested by preparing an inspection stage cooled at a low temperature encapsulated in a shield casing with a front opening, conveying a chip of LD, LED or PD by a collet via the opening, placing the chip on the cold stage, blowing the stage and chip with cool dry air for preventing the chip from wetting, touching the chip by a probe, applying a current/voltage to the chip, examining emission/detection of the chip and taking the chip off via the opening by the collet.

Temperature characteristic inspection device

A rear surface emission type light emitting diode emits light beams produced at a narrow emanating region out of the rear surface of the substrate. Preferably a device chip should be directly equipped with a lens on the rear surface. A plurality of light emitting devices with a package are laid on an XY-stage which can move in an XY-plane. A camera, a dispenser and a vacuum collet can transfer in Z-direction. The distances and the directions among the camera, the dispenser and the collet are predetermined values. The chip is actually examined by letting it emit light beams from the emanating region. The light is observed by the camera to obtain light power distribution on individual pixels. From the light power, the center of the emanating region is determined. The XY-stage is displaced till the center of the emanating region coincides with the center of the camera. Then the XY-stage is moved by the predetermined distance to send the chip just beneath the dispenser. The dispenser comes into contact with the chip and supplies ultraviolet resin to the chip. The XY-stage is again displaced by the predetermined distance to feed the chip below the vacuum collet holding a lens. The collet brings the lens in the resin on the surface till the lens touches the surface. Ultraviolet rays are cast on the ultraviolet hardening resin to stiffen the resin.

Method of mounting a lens on a light emitting diode

The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional relationship; a wire connection means 202 and 213 for connecting the wires to the members, the frame and the electronic circuits on the frame as the members and the frame remain kept in the positional relationship; conveyors 207, 208 and 209 for conveying the members and the frame to dies 204 after the connection as the members and the frame remain kept in the relationship; and a die-setting means 203 for setting the members and the frame in the dies through the suction of the members and the frame away from the pallet onto the setting means after the conveyance as the members and the frame remain kept in the relationship.

Method for manufacturing an optical module

The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional relationship; a wire connection means 202 and 213 for connecting the wires to the members, the frame and the electronic circuits on the frame as the members and the frame remain kept in the positional relationship; conveyors 207, 208 and 209 for conveying the members and the frame to dies 204 after the connection as the members and the frame remain kept in the relationship; and a die-setting means 203 for setting the members and the frame in tile dies through the suction of the members and the frame away from the pallet onto the setting means after the conveyance as the members and the frame remain kept in the relationship.

Apparatus for manufacturing optical module

Optical receiver/transmiter module

Optical receiver/transmitter module

Growing community of inventors

Osaka, Japan

Mitsutoshi Kamakura