Shinko Electric Industries Co., Ltd.

Taiyo Yuden Co., Ltd.

Koito Manufacturing Company, Ltd.

Adv Antest Corporation

Naganoken and Shinko Electric Industries Co., Ltd.

Shinko Electric Electric Industries Co., Ltd.

Mitsutoshi Higashi

Kei Murayama

Masahiro Sunohara

Hideaki Sakaguchi

Akinori Shiraishi

Yuichi Taguchi

Naoyuki Koizumi

Hiroko Koike

Toshinori Koyama

Naohiro Mashino

Takashi Mochizuki

Kazutaka Kobayashi

Takashi Kurihara

Kiyoaki Iida

Masatoshi Akagawa

Kazuo Tanaka

Hajime Iizuka

Tsuyoshi Kobayashi

Mitsuhiro Aizawa

Akihito Takano

Shigeru Mizuno

Kenichi Ota

Yuichi Sasajima

Masakuni Tokita

Norio Kondo

Takehiko Arai

Shigeru Matsumura

Yukiharu Takeuchi

Hiroyuki Kato

Yasuaki Tsutsumi

Masanobu Mizuno

Yasutaka Sasaki

Susumu Arai

Toshio Gomyo

Katsushi Sugai

Rie Arai

Tohru Watanabe

Katsunori Yamagishi

Koji Nagai

Kohei Kato

Koji Omori

Koichi Shiroyama

There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.

Interposer and semiconductor device including the same

A light emitting device is provided with a semiconductor light emitting element and a wavelength conversion portion. The wavelength conversion portion includes an outer peripheral portion between an input surface and an output surface. The outer peripheral portion includes a first inclined part at a side of the input surface and a second inclined part at a side of the output surface. The first inclined part and the second inclined part define a projecting portion that is projected on the outer peripheral portion.

Light emitting device that includes wavelength conversion layer having outer peripheral portion having convex projecting part with light reflection layer formed thereon

In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.

Probe card and manufacturing method thereof

A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.

Probe card and method for manufacturing probe card

[Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substratewhich is used for testing a semiconductor wafer, comprises a main body portion, thin portionsextending from the main body portionand being relatively thinner than the main body portion, and bumpsprovided on the thin portions

Test-use individual substrate, probe, and semiconductor wafer testing apparatus

An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post.

Electronic component device, method of manufacturing the same and wiring substrate

A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part.

Wiring board, semiconductor device, and method for manufacturing wiring board

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

Wiring board and method of manufacturing the same

A substrate manufacturing apparatushas a substrate delivery paththrough which a multi-unit substrateis delivered and a mask delivery paththrough which an individual maskis delivered. The substrate delivery pathhas a pad detecting devicefor detecting a position of a padformed on a surface of the substrate. The mask delivery pathhas a mask hole detecting devicefor detecting a position of a conductive ball inserting holeof the individual mask. A moving position of an adsorbing headis adjusted in such a manner that the position of the conductive ball inserting holeis coincident with that of the padof the substratebased on pad position information of the pad detecting deviceand mask hole position information of the mask hole detecting device

Substrate manufacturing method

A wiring board includes a silicon substrate with a through hole communicating with first and second substrate surfaces. A capacitor includes a capacitor part mounted on an insulating film covering the substrate first surface and including a first electrode on the insulating film, a first dielectric layer on the first electrode, and a second electrode on the first dielectric layer. A multilayer structure arranged on a wall surface defining the through hole includes the insulating film on the through hole wall surface, a first metal layer on the insulating film formed from the same material as the first electrode, a second dielectric layer on the first metal layer formed from the same material as the first dielectric layer, and a second metal layer on the second dielectric layer formed from the same material as the second electrode. The multilayer structure covers a penetration electrode in the through hole.

A light emitting device includes a light emitting element mounting component, including a cubic package component formed of a silicon member covered with a insulating layer, and the package component including a bottom portion, a sidewall portion provided to stand upright on both ends of the bottom portion respectively, and a backwall portion provided to stand upright on an innermost part of the bottom portion, and the package component in which a cavity is provided in an inner side, and a light emitting element mounted on an inner side surface of the backwall portion of the package component, and including a light emitting surface on an upper end part, wherein a plurality of said light emitting element mounting components are stacked in a depth direction of the cavity to direct toward an identical direction.

Light emitting device and package component

A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.

Package for electronic component, manufacturing method thereof and sensing apparatus

A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion is connected to a cover to thereby seal a light emitting element. A seal structure is composed of an uneven portion formed on the lower surface side surface of the base, a close contact layer formed on the surface of the uneven portion, a power supply layer formed on the close contact layer, and an electrode layer formed on the surface of the power supply layer. The uneven portion includes a first recessed portion formed at a position spaced in the radial direction from the outer periphery of a through electrode or from the inner wall of a through hole, and a second recessed portion formed at a position spaced further outwardly from the first recessed portion.

Substrate and method for manufacturing the same

A heat radiation package of the present invention includes a substrate in an upper surface side of which recess portion is provided, embedded wiring portion which is filled in the recess portion of the substrate and on which semiconductor element which generates a heat is mounted, and a heat sink connected to a lower surface side of the substrate. The substrate is made of silicon, ceramics, or insulating resin.

Heat radiation package and semiconductor device

A semiconductor chip includes a semiconductor substrate, a through via provided in a through hole that passes through the semiconductor substrate, insulating layers laminated on the semiconductor substrate, a multi-layered wiring structure having a first wiring pattern and a second wiring pattern, and an external connection terminal provided on an uppermost layer of the multi-layered wiring structure, wherein the through via and the external connection terminal are connected electrically by the second wiring pattern.

Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole

Growing community of inventors

Nagano, Japan

Mitsutoshi Higashi