Canon Kabushiki Kaisha

Canon Kabukikaha Kaisha

Mitsutoshi Hasegawa

Kazuya Shigeoka

Yoshikazu Banno

Masahiko Miyamoto

Etsuro Kishi

Kazuhiro Sando

Tokutaka Miura

Masaki Tokioka

Yutaka Arai

Nobuhiro Ito

Ihachiro Gofuku

Kunihiko Minegishi

Satoru Higuchi

Kazuo Koyanagi

Tetsuya Kaneko

Takashi Sakaki

Koji Noguchi

Noritake Tsuboi

Hideaki Mitsutake

Toshihiko Miyazaki

Yoshihiro Yanagisawa

Miki Tamura

Shuji Yamada

Takeo Ono

Osamu Takamatsu

Eiji Yamaguchi

Yuji Kasanuki

Yasuyuki Todokoro

Yuya Okada

Seiji Mishima

Tomonori Nakazawa

Shingo Ishiguri

Hisaaki Kawade

Toshimitsu Kawase

Yoshiyuki Osada

Koichiro Nakanishi

Kinya Kamiguchi

Masahiro Tagawa

Hideshi Kawasaki

Yasuo Ohashi

Noriaki Ohguri

Yoshimasa Okamura

Toru Sugeno

Kou Komatsu

Hiroharu Ueda

Toshifumi Yoshioka

Yasuhiro Hamamoto

Shigeto Kamata

Takashi Aoki

Hidetoshi Suzuki

Naoto Abe

Masato Yamanobe

Hiroshi Takagi

Takayuki Teshima

Sotomitsu Ikeda

Toshitami Hara

Akihiro Kimura

Yoichi Ando

Hidetoshi Nojiri

Hiroyuki Ozaki

Yoshinobu Sekiguchi

Junri Ishikura

Tomohiro Saito

Seiichi Miyazawa

Mamo Matsumoto

Yuichi Handa

Masahito Niibe

Yoshitomo Fujisawa

Kosuke Kurachi

Yuya Karakawa

Toshiaki Himeji

An electronic module includes at least one electronic component including a first principal surface, first and second electrodes on the first principal surface, a wiring board including a second principal surface, third and fourth electrodes on the second principal surface, and a conductive resin portion. The conductive resin portion includes at least one first conductive resin portion joining the first and third electrodes, and at least one second conductive resin portion joining the second and fourth electrodes. The electronic module further includes at least one reinforcing resin portion that is disposed between at least one first and at least one second conductive resin portions and joins the first principal surface of the electronic component with the second principal surface of the wiring board.

Electronic module and apparatus

A wiring component includes a first wiring portion including a plurality of wirings arranged side by side in a first direction, a second wiring portion including a plurality of wirings arranged side by side in a second direction, and a coupling portion configured to couple the first wiring portion and the second wiring portion to each other, wherein an angle formed by the first direction and the second direction is changeable by deformation of the coupling portion.

Wiring component, module, apparatus, and method for manufacturing module

An electronic module includes a rigid printed circuit member having a first electrode, a flexible printed wiring member having a second electrode, and a solder member having first, second, and third portions. A first direction is perpendicular to, and a second direction is parallel to, a joined surface between the first electrode and the solder member. In the first direction, a second region of the first electrode partially overlaps a leading edge of the second electrode. In the second direction, the second portion is located between the first portion and the third portion and is continuous to each of the first portion and the third portion. A height of the third portion from a reference surface including the joined surface is larger than a height of the second portion from the reference surface and is smaller than a height of the first portion from the reference surface.

A printed wiring board has a first conductive layer including a second electrode group bonded to a first electrode group of a flexible printed circuit board, and a second conductive layer, and a plane including the second conductive layer includes a first region including a reference region set in a bonded portion, a second region via a first boundary, and a third region via a second boundary, and a first boundary portion is positioned within a range of 0.5 times or more and 5 times or less a length of a short side of four sides in a prescribed direction, and a second boundary portion is positioned within a range of 0.5 times or more and 5 times or less the length of the short in a prescribed direction, and a density of the second conductive layer in the first region is higher than that in the second region.

Electronic module, imaging unit and equipment

An electronic module includes a first wiring board, a second wiring board, and an intermediate connection member. The intermediate connection member includes an insulator, a plurality of first wirings supported by the insulator and arranged at intervals in a second direction intersecting a first direction, a plurality of second wirings supported by the insulator and arranged at intervals in the second direction, and a metal layer supported by the insulator and interposed between the plurality of first wirings and the plurality of second wirings so as to oppose the plurality of first wirings and the plurality of second wirings in a third direction intersecting the first direction and the second direction. A part of the metal layer sandwiched in the insulator is bonded to one of the first wiring board or the second wiring board by a conductive first bonding member.

Electronic module, intermediate connection member, and electronic device

An intermediate connection member includes a first insulating substrate portion, a second insulating substrate portion, an insulating layer portion provided between the first insulating substrate portion and the second insulating substrate portion and formed from a different material from the first insulating substrate portion and the second insulating substrate portion, a plurality of first wiring portions provided between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction such that both end portions of the plurality of first wiring portions in the first direction are exposed to an outside, and a plurality of second wiring portions provided between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction such that both end portions of the plurality of second wiring portions in the first direction are exposed to the outside.

Intermediate connection member, method for manufacturing intermediate connection member, electronic module, method for manufacturing electronic module, and electronic equipment

An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.

Electronic module, electronic equipment, imaging sensor module, imaging apparatus, and display apparatus

A module includes a first wiring board, a first integrated circuit component mounted on the first wiring board, a second wiring board overlapping with the first wiring board, a second integrated circuit component mounted on the second wiring board, and a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board, wherein the second integrated circuit component overlaps with the first wiring board and supplies power to the first integrated circuit component via the connection member.

Module and equipment

An image pickup unit includes: a printed wiring board provided with an image pickup element and having a first electrode on a surface layer; a flexible wiring substrate having a base member having first and second faces, a conductive layer provided on the first face, and an insulating layer provided on the conductive layer, wherein the conductive layer has a second electrode in which the insulating layer is not provided to one longitudinal end part; a conductive connection member that connects the first electrode to the second electrode; and a reinforcement member provided on the base member on the second face side, wherein the reinforcement member continuously covers an end part of the insulating layer on a side closer to the second electrode and an end part of the conductive connection member on a side closer to the insulating layer of a portion connected to the second electrode.

Image pickup unit and imaging apparatus

A flexible wiring board includes: an insulator; a wiring layer supported by the insulator; a first terminal unit including connection terminals provided at one end of the wiring layer; and a second terminal unit including connection terminals provided at the other end. A portion of the wiring layer from a part adjacent to the first terminal unit to a part adjacent to the second terminal unit is provided between first and second insulator layers included in the insulator. First and second holes formed in the first or second insulator layer are provided in an intermediate portion in a first direction from the first terminal unit to the second terminal unit and are spaced apart from each other in the first direction, and an insulator region adjacent to the first hole in a second direction is adjacent to at least a part of the second hole in the first direction.

Flexible wiring board, module, and electronic device

A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

Semiconductor module and electronic apparatus

A printed circuit board includes an electronic component including a first land, a printed wiring board including a resist portion and a second land, and a connecting portion interconnecting the first land and the second land. An opening larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion protruding from the body portion, the body portion being disposed further on an inside than an outer edge of the first land, and at least part of the protruding portion protruding further to an outside than the first land.

Printed circuit board and electronic device

A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.

Method of manufacturing electronic module, electronic module, and electronic device

A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.

Method for manufacturing printed circuit board, printed circuit board, and electronic device

Growing community of inventors

Yokohama, Japan

Mitsutoshi Hasegawa