Daicel-evonik Ltd.

Daicel Chemical Industries, Ltd.

Daicel-degussa Ltd.

Other

Honda Motor Co., Ltd.

Daicel-huls Ltd.

Daicel Huels Ltd.

Nakano Manufacturing Co., Ltd.

Polyplastics-evonik Corporation

Mitsuteru Mutsuda

Hajime Komada

Toru Ikuta

Hiroaki Arita

Yoshiki Nakaie

Naoki Wakita

Takayuki Uno

Tatsuki Akashi

Hirofumi Iguchi

Toshiaki Nakamura

Haruhisa Masuda

Masanori Hiraishi

Shinichi Matsumoto

Yuki Adachi

Kenji Nakama

Nao Sato

Yasufumi Nakajima

Daisuke Fujiki

Tomohiro Kawahara

Ryo Nakahama

Atsushi Inagaki

Kimihiko Oya

Nobuhiro Nozato

Masaru Kitada

Thomas Grosse-Puppendahal

Mutsuo Tezuka

Toshihiko Fujinaka

Prepared is a laminate including: a first layer formed of a first resin composition containing a first resin; and a second layer formed of a second resin composition containing a second resin, the first layer and the second layer being in contact with each other and integrated. The first resin includes an alicyclic polyamide resin having 20 mmol/kg or greater of amino groups, and the second resin includes an acid-modified (meth)acrylic resin. The second resin may have 100 mmol/kg or greater of carboxyl groups. The acid-modified (meth)acrylic resin may be an acid-modified polymethylmethacrylate resin. An average thickness of the first layer may be 0.15 times or more of an average thickness of the second layer. The average thickness of the first layer may be 200 μm or greater. When a weight is dropped onto the second layer side, the laminate may have a DuPont impact strength of 500 N/inch or greater. The laminate has excellent transparency, lightness, light resistance, and impact resistance.

Laminate, method for producing same, and use of same

[Object] The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal. [Solution] A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.

Curable resin composition, use thereof, and production method thereof

Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a Calkylene chain and has a melting point from 160 to 250° C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.

Curable resin composition, composite member, and production method therefor

Provided is a method for producing resin particles by melt-kneading with a non-water-soluble resin in a wide range of melt-kneading temperature according to the melting point or glass transition temperature of the resin. This production method includes melt-kneading a water-soluble matrix, containing a modified polyvinyl alcohol-based resin, and a non-water-soluble resin to form a pre-molded article in which the non-water-soluble resin is dispersed in particulate; and bringing the pre-molded article into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).

Method for producing resin particles

The present invention provides a composite molded body in which a rubber layer in the form of a thin film is formed on a surface of a resin molded body and a production method therefor. According to an embodiment of the present invention, a liquid composition containing a rubber component such as a rubber latex and a peroxide is applied to a surface of a resin molded body such as a polyamide-based resin having an amino group, causing crosslinking to occur in an uncrosslinked rubber layer and forming a crosslinked rubber layer in the form of a thin film. When a co-crosslinking agent is used in combination, adhesion to the resin molded body can be improved even when the thickness of the crosslinked rubber layer is small.

Composite molded body and production method therefor

(A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10&#xb0; C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 &#x3bc;m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150&#xb0; C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100&#xb0; C., or a polyamide resin having a &#x3b3;-type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.

Fiber-reinforced resin, process for producing same, and molded article

Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150&#xb0; C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 &#x3bc;m and a specific surface area determined by the BET method of approximately 0.08 to 12 m/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 &#x3bc;m. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10&#xb0; C./min by differential scanning calorimetry (DSC).

Polyamide particles, production process therefor, resin composition, and molded article

Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).

Water-soluble matrix, pre-molded article containing resin particles, and method for producing resin particles

A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165&#xb0; C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).

Sheet for shoe sole and shoe sole including the same

A resin powder containing an aromatic polyetherketone resin (e.g., a polyetheretherketone) is deformed into a plate-like form, and the resulting powder is used as a resin powder for a coating material. The plate-like resin powder may have an average thickness of, for example, not more than 2 &#x3bc;m. The coating material may contain a dispersing agent or may be dispersed in a dispersion medium, such as water. The coating material may particularly be used as a coating material for covering a metal substrate. The plate-like resin powder, which comprise an aromatic polyetherketone resin, allows formation of a coating layer which has a high adhesion to a substrate and in which the generation of pinholes is efficiently prevented or reduced.

Laminar resin powder and paint containing same

In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin (C), the resin particle (B) comprises a spherical resin particle having an average particle diameter of 12 to 70 &#x3bc;m. In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin, the resin particle (B) comprises (B1) a spherical small resin particle having a particle diameter less than an average fiber diameter of the reinforcing fiber (A) and (B2) a spherical large resin particle having a particle diameter not less than the average fiber diameter of the reinforcing fiber (A). The reinforcing fiber (A) may particularly comprise a carbon fiber. The resin particle (B) may particularly comprise a polyamide resin particle. The resin particle (B) may have an average particle diameter of 1 to 10 times as large as the average fiber diameter of the reinforcing fiber (A). In such a composition, the proportion of the resin particle (B) may be not more than 10% by weight (e.g., 1 to 5% by weight) in the total amount of the resin particle (B) and the matrix resin (C). A small amount of the resin particle achieves a sufficient reinforcing function of the reinforcing fiber.

Fiber-reinforced resin and method for producing same, and molded article

Provided is an additive that increases or improves a light resistance of anon-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin. The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).

Light-resistance improver

Provided is an additive that increases or improves a light resistance (or whiteness) of a non-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin and an inorganic white pigment (e.g., titanium oxide). The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).

Light-resistant resin composition, and moulded body thereof

A thermoplastic resin composition having a high flame retardancy in a thin-wall molded product and a molded article thereof are provided. The thermoplastic resin composition comprises (A) a thermoplastic resin containing a repeating unit having an arylene group, an ether group, and a carbonyl group and (B) a thermoplastic fluorine-containing resin. The weight ratio of the thermoplastic resin (A) and the thermoplastic fluorine-containing resin (B) in the former/the latter is 80/20 to 99/1. The thermoplastic fluorine-containing resin (B) is dispersed in the form of a particle in the thermoplastic resin (A) to form a dispersed phase, and the dispersed phase has an average particle diameter of not more than 3 &#x3bc;m. The thermoplastic resin composition is suitable for forming a molded article having a thin-wall portion with a thickness of not more than 1.5 mm.

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Himeji, Japan

Mitsuteru Mutsuda