Kyocera Corporation

Dainichi Co., Ltd.

Mitsutaka Shimada

Kyosuke Yamauchi

Mitsuhiro Nakamura

Yoshifumi Yamagata

Kazuhiro Otsuka

Akira Oikawa

Takayuki Maruyama

Tatsuya Kanbayashi

Masafumi Hisataka

Michihiko Kuwahata

Masaru Yamano

Kiyohiro Iioka

Wataru Koga

Naoki Yokoo

Shinichiro Kitanishi

Michitada Okada

A fuel cell apparatus includes a fuel cell module including a housing and a fuel cell housed in the housing, the fuel cell generating electric power with use of a fuel gas and an oxygen-containing gas; and a heat exchanger which carries out heat exchange between a medium and exhaust gas from the fuel cell module, the heat exchanger being arranged laterally to the housing.

Fuel cell apparatus

A fuel cell system includes a controller that controls an amount of air flow to be supplied from an air blower included in an oxygen-containing gas supply to a cell stack to cause a power level (in amperes) of a fuel cell controllable by a power level regulator (power conditioner) and an air utilization to have an increase-control section in which the air utilization increases in accordance with an increase in the power level of the fuel cell and a decrease-control section in which the air utilization decreases in accordance with an increase in the power level. The air utilization is a ratio of an air amount used by the fuel cell for power generation to an oxygen-containing gas (air) amount supplied to the fuel cell.

Fuel cell system

A fuel cell module may include: a cell stack device including a cell stack including an array of a plurality of fuel cells, a manifold which supplies a fuel gas to each of the fuel cells, and a reformer which reforms a raw fuel; an oxygen-containing gas flow channel through which the oxygen-containing gas flows; an oxygen-containing gas introduction plate which supplies the oxygen-containing gas to each of the plurality of fuel cells; a housing including a box body of which one side is opened to provide an opening and a lid (closed plate) which closes the opening; a gas pipe joint, an ignition heater, a thermocouple, etc. which are a plurality of insertion members inserted from an outside of the housing into an accommodation chamber, the respective insertion members being inserted through one surface (lid surface) of the housing.

Fuel cell module and fuel cell apparatus

A fuel cell module includes: a cell stack apparatus including a cell stack including an array of a plurality of fuel cells, a manifold which feeds a fuel gas to each of the fuel cells, and a reformer which reforms a raw fuel; an oxygen-containing gas introduction plate which feeds an oxygen-containing gas to each of the fuel cells; and a housing which houses the cell stack apparatus and the oxygen-containing gas introduction plate. The housing includes a box having an open side and a lid which closes the open side of the box, and the box has a length of the open side which is greater than a maximum length of a projected plane of the cell stack apparatus as viewed from a lateral side of the cell stack apparatus.

Fuel cell module, fuel cell apparatus, and fuel cell module manufacturing method

A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substratewith one principal surface thereof formed with an IDT electrode, a connector electrodeand a periphery sealing electrode, and a base substrateformed with an electrodefor connection to the element connected to the connector electrodethrough a solder bump componentand a periphery sealing conductor filmjoined to the periphery sealing electrodethorough a solder sealing component. For the solder bump componentand the solder sealing component, a Sn&#x2014;Sb based or Sn&#x2014;Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrateis set in the range of 9-20 pm/&#xb0; C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.

Method for manufacturing surface acoustic wave device

A plurality of surface acoustic wave elements, with an IDT electrodeand a pad electrodeformed on the principal surface of a piezoelectric substrate, are formed to be flip-chip mounted on a circuit boardand sealed using sealing resin. The circuit boardis diced integrally with the sealing resinapplying a rotating dicing bladefrom the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin

A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substratewith one principal surface thereof formed with an IDT electrodea connector electrodeand a periphery sealing electrodeand a base substrateformed with an electrodefor connection to the element connected to the connector electrodethrough a solder bump componentand a periphery sealing conductor filmjoined to the periphery sealing electrodethorough a solder sealing componentFor the solder bump componentand the solder sealing componenta Sn&#x2014;Sb based or Sn&#x2014;Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrateis set in the range of 9&#x2013;20 pm/&#xb0; C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.

Growing community of inventors

Kokubu, Japan

Mitsutaka Shimada