Murata Manufacturing Co., Ltd.

Mitsushi Takatori

Kenji Sakaguchi

Masanobu Watanabe

A surface acoustic wave device includes a surface acoustic wave element, a packaging case, and a packaging electrode. The surface acoustic wave element has a piezoelectric substrate, an interdigital transducer, an electrode pad, an intermediate electrode, an upper electrode, and a bump electrode. The intermediate electrode is preferably made of NiCr including about 15 to about 30 weight percent of Cr. The electrode pad and upper electrode are made of Al. The bump electrode is press-bonded to the packaging electrode with an ultrasonic wave or heat applied to the bump electrode. The resulting surface acoustic wave device has excellent characteristics and the surface acoustic wave element is not removed or peeled from the packaging case during a drop test.

Surface acoustic wave element, surface acoustic wave device using the same, and method for manufacturing surface acoustic wave element and surface acoustic wave device

Growing community of inventors

Ishikawa-ken, Japan

Mitsushi Takatori