Kabushiki Kaisha Toshiba

Toa Medical Electronics Co., Ltd.

Mitsuru Watanabe

Tetsuya Fukui

Hiroshi Yamamoto

Yasunori Maekawa

Kaoru Asano

Ken Ishihara

Akio Suzuki

Yasuhiro Kouchi

A semiconductor device comprises: a semiconductor chip; a first frame; a solder layer which bonds the solder bonding metal layer of the semiconductor chip and the first frame; and a second frame bonded to the rear face of the semiconductor chip. The semiconductor chip includes: a semiconductor substrate; a first metal layer provided on a major surface of the semiconductor substrate and forming a Schottky junction with the semiconductor substrate; a second metal layer provided on the first metal layer and primarily composed of aluminum; a third metal layer provided on the second metal layer and primarily composed of molybdenum or titanium; and a solder bonding metal layer provided on the third metal layer and including at least a fourth metal layer which is primarily composed of nickel, iron or cobalt.

Semiconductor device and method of manufacturing same

A semiconductor device comprises: a semiconductor chip; a first frame; a solder layer which bonds the solder bonding metal layer of the semiconductor chip and the first frame; and a second frame bonded to the rear face of the semiconductor chip. The semiconductor chip includes: a semiconductor substrate; a first metal layer provided on a major surface of the semiconductor substrate and forming a Schottky junction with the semiconductor substrate; a second metal layer provided on the first metal layer and primarily composed of aluminum; a third metal layer provided on the second metal layer and primarily composed of molybdenum or titanium; and a solder bonding metal layer provided on the third metal layer and including at least a fourth metal layer which is primarily composed of nickel, ion or cobalt.

A semiconductor device has a semiconductor device chip with upper and lower terminal electrodes, and upper and lower frames bonded to the upper and lower terminal electrodes, respectively, with solder material, wherein the semiconductor device chip includes: a semiconductor layer of a first conductivity type; a diffusion layer of a second conductivity type, which is selectively formed in the semiconductor layer; a plurality of guard-ring layers of the second conductivity type, which are formed outside of the diffusion layer in the semiconductor layer; an insulating film formed on the semiconductor layer; and a field plate formed of a poly-crystalline silicon film embedded in the insulating film.

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

A non-invasive blood analyzer is intended to capture images of a prescribed volume of blood in a blood vessel in a non-invasive manner and with a good contrast without collecting blood from a living body. The non-invasive blood analyzer includes a light application device for illuminating a detection region of vessels contained in a part of a living body, an image capturing device for capturing images of the detection region illuminated by the light application device, and an analyzer for analyzing blood components contained in the detection region by processing the images captured by the image capturing device. The image capturing device includes an object lens for converging the reflected light from the detection region. The light application device illuminates the detection region at an incident angle larger than an aperture angle of the object lens with respect to the detection region to provide dark-field illumination.

Non-invasive blood analyzer

A non-invasive blood analyzer includes a light application device for applying light to a detection region of vessels contained in part of the living body, an imaging device for imaging the detection region to which light is applied, a fixing device for relatively fixing the imaging device and the part of the living body; a stabilizing device for stabilizing a focus of the imaging device with respect to the detection region; and an analyzer for analyzing the morphology and/or number of blood cells contained in the detection region by processing images captured with the imaging device, the light application device and the imaging device forming one image with a light application and capturing process during an interval of one ten thousandth to one billionth of a second.

Growing community of inventors

Hyogo, Japan

Mitsuru Watanabe