Sumitomo Osaka Cement Co., Ltd.

Mitsuru Sakuma

Junichiro Ichikawa

Norikazu Miyazaki

Masayuki Ichioka

Yuji Yamane

Takahisa Fujita

Provided is an optical waveguide device capable of reducing stress that occurs inside an optical waveguide substrate due to a difference in a coefficient of thermal expansion. The optical waveguide device () includes an optical waveguide substrate () having a thickness of 30 &#x3bc;m or less, and a liquid crystal polymer substrate () which holds the optical waveguide substrate () and has permittivity lower than that of the optical waveguide substrate (). The optical waveguide substrate () and the liquid crystal polymer substrate () are bonded to each other by an adhesive layer (). Coefficients of thermal expansion of the optical waveguide substrate () and the liquid crystal polymer substrate () have anisotropy in each substrate plane, and a relative direction between the optical waveguide substrate () and the liquid crystal polymer substrate () is adjusted in such a manner that anisotropic axial directions of the optical waveguide substrate () and anisotropic axial directions the liquid crystal polymer substrate () are aligned.

Optical waveguide device

The present invention offers an optical modulator capable of efficiently transmitting electric signals to an interaction part of a signal electrode with acting on an optical waveguide even when the electric signals are in a high frequency zone, and capable of performing high frequency broad-band operation. The optical modulator comprises a substrateformed of a material having electro-optical effect, an optical waveguide formed on the substrate, and an electrodefor modulating the light passing through the optical waveguide. The optical modulator is characterized in that an electric signal connection pad unitis provided on a part of the electrode, and in that the thickness of the substrate located on a lower part of at least the electric signal connection pad unitand directly or indirectly continuous to the electric signal connection pad unitis thinner than the thickness of another part of the substrate including an interaction part of the electrode by cutting off a part of the substrate, and is less than about 250 &#x3bc;m.

Growing community of inventors

Tokyo, Japan

Mitsuru Sakuma