Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Mitsuru Ozono

Tadahiko Sakai

Seiichi Sato

Nobuyuki Suefuji

Hiroshi Haji

Nobuyuki Iwashita

Shoji Sakemi

Hideki Eifuku

Teruaki Kasai

Hitoshi Mukojima

Yoshiyuki Wada

Tadashi Maeda

Kiyoshi Arita

Masaru Nonomura

Kazuhiro Noda

Shinji Sasaguri

Provided is a component bonding method of bonding a semiconductor component having a thermosetting adhesive layer formed on a lower surface thereof to a circuit board having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface of the circuit board, the semiconductor component is held by a component holding nozzle having a heater, the adhesive layer is contacted to the surface-modified resin layer, and the adhesive layer is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer and the resin surface is improved, and thus the component holding nozzle can be separated from the semiconductor component without wait for completely hardening the adhesive layer. Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.

Component bonding method, component laminating method and bonded component structure

In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

In an electronic component soldering method of connecting a terminal provided on a flexible substrate to an electrode of a rigid substrate, after solder-mixed resin in which solder particles are mixed in thermosetting resin has been applied onto the rigid substrate so as to cover the electrode, the flexible substrate is put on the rigid substrate and heat-pressed, whereby there are formed a resin part that bonds the both substrates by thermosetting of the thermosetting resin, and a solder part which is surrounded by the resin part and has narrowed parts in which the peripheral surface is narrowed inward in the vicinity of the terminal surface and in the vicinity of the electrode surface. Hereby, the solder parts are soldered to the electrodes and the terminal at acute contact angles so that the production of shape-discontinuities which lowers fatigue strength can be eliminated.

Electronic component soldering structure and electronic component soldering method

In an adhesive sheet exfoliation process in a pick-up operation for a thin-type chipadhered to the adhesive sheeta suction exfoliation toolprovided at its adhesion surfacewith plural suction groovesis abutted against the lower surface of the adhesive sheet. Then, air within the suction groovesare vacuum-sucked to bend and deform the adhesive sheettogether with the chipthereby to exfoliate the adhesive sheetfrom the lower surface of the chipdue to such bending deformation. Thus, it is possible to realize the picking-up operation with high productivity without causing a problem such as breakage or crack.

Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor

In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powderis mixed into flux employed so as to intervene between a bump and an electrode. The metallic powderhas a flake or dendrite shape including a core segmentof the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segmentof the metal with good-wettability for the molten solder and to be solid-solved in the core segmentmolten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particlesThus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

Method for soldering electronic component and soldering structure of electronic component

In a semiconductor device provided with a thinned semiconductor element, the present invention intends to inhibit damage of the semiconductor element in the neighborhood of its outer periphery so as to improve reliability. A plurality of external connection terminals are formed on a front surface of the thinned semiconductor element. A plate higher in rigidity than the semiconductor element is adhered with a resin binder to a rear surface of the semiconductor element. An outer shape of the plate is made larger than that of the semiconductor element, and the resin binder covers a side face of the semiconductor element to form a reinforcement portion for reinforcing a periphery of the semiconductor element.

Semiconductor device and method for assembling the same

In an electronic component mounting process for mounting electronic components () to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the substrate is picked up with suction nozzle provided with individual heater, and a time taken for the mounting operation is so allotted that a first heating time of a duration from a moment when the suction nozzle comes into contact with the electronic component for picking it up till another moment immediately before it begins a mounting motion to the substrate is longer than a second heating time of a duration from the moment when the suction nozzle begins the mounting motion till another moment when it leaves the electronic component mounted to the substrate.

Electronic component mounting apparatus and method of mounting electronic components

The method of manufacturing a semiconductor device of the present invention comprises: forming a resin layer on a surface of a semiconductor wafer on which a plurality of semiconductor elements are formed, forming through-holes on the resin layer, a first cutting of either the semiconductor wafer or the resin layer, mounting conductive balls on the through-hole, connecting the conductive ball to electrodes of the semiconductor element, and a second cutting for dividing the wafer into each piece of semiconductor devices. With the processes of the present invention, conductive balls can be easily and effectively mounted on a wafer under optimum conditions, without failure such as slipping or falling down from the required position. This fact contributes to an increased efficiency and a good productivity in the production of semiconductor devices.

Method of manufacturing semiconductor device

In a seal mechanism which constitutes a port switching portion in a pump mechanism of a paste ejection apparatus that ejects paste, and which prevents leakage of the paste from a seal portion between a plunger block rotating with a plunger and a fixed seal block (between a seal surface and a sliding surface), a housing portion is formed by opposing an outer surface provided for the seal block to an inner surface extending axially from the cylinder block, and a ring-shaped external seal member formed by combination of an O-ring and self-lubricant material such as PTFE is attached into the housing portion. Hereby, it is possible to prevent the paste that has leaked from the seal portion from leaking to the outside of the housing portion by the external seal member.

Paste ejection apparatus

A semiconductor device having a thinned semiconductor element that can be easily handled is manufactured with a method of manufacturing. The semiconductor device includes a semiconductor element and a bumper member bonded, as a reinforcing member, to a back surface opposite to an electrode-formed surface of the semiconductor element with an adhesive. The adhesive has a low elastic modulus and easily expands and contracts after bonding, and bonds the semiconductor element to the bumper member while allowing the semiconductor element to be deformed. Thus, the semiconductor device can be easily handled, and the semiconductor element can be deformed in response to the deformation of a substrate after being mounted. In addition, a thermal stress in a heat cycle can be alleviated effectively.

Semiconductor device, method of manufacturing the device and method of mounting the device

A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.

Paste applicator and paste application method for die bonding

A semiconductor device assembly and a semiconductor device are provided which both can ensure reliability after a mounting process. The semiconductor device includes a semiconductor element equipped with bumps on an electrode patterned surface thereof for external connection. In the semiconductor device mounted on a substrate in the semiconductor device assembly, a semiconductor element shaped to have a thickness ranging from 200 &mgr;m to 10 &mgr;m has reduced flexural rigidity so as to be easily deflected. In the status that the bumps are joined to corresponding circuitry electrodes on the substrate, the semiconductor element can deflect at other portions other than its surface between two adjacent bumps according to contraction and distortion of the substrate. This allows the bumps to be dislocated in a direction parallel to a surface of the semiconductor element, hence relieving stress developed by the contraction of the substrate at the joint positions between the bumps and the circuitry electrodes.

Semiconductor device and semiconductor device assembly

The object of the present invention is to provide a bonding paste applicator and a method of applying a bonding paste which allow satisfactory paste applying quality and excellent operability to be realized. A bonding paste application method for applying a bonding paste by making a drawing with a paste applying nozzle made to move to a position, where a chip is mounted on a substrate, comprises the steps of storing in advance in a storing unit a drawing pattern for controlling each of X, Y and Z axes to move a paste applying nozzle and a drawing pattern setting table to show a category corresponding to the size of a chip to be bonded, selecting a drawing pattern corresponding to the size of the chip, which has been designated, by means of a drawing pattern selecting unit and obtaining a speed pattern for each of the X, Y and Z axes based on the selected drawing pattern by means of a speed pattern computing unit . Accordingly, it is no longer required to set up a drawing pattern every time occasion demands and a paste can be applied properly with excellent paste applying quality and satisfactory operability without fail.

Bonding paste applicator and method of using it

A method of applying a bonding paste efficiently and uniformly by discharging the bonding paste from an application nozzle is presented. For applying the paste along a drawing pattern including a cross shape pattern composed of crossing plural application lines, the nozzle moves from the center of the cross shape to an end point along one application line, turns to a reverse direction at the end point, and moves to an end point at opposite side of the application line. Then, the nozzle returns from the end point to the center of the cross shape. The nozzle repeats this unit application line drawing operation for each application line. As a result, the nozzle stops less frequently near the center, has a shortened cycle time, and applies the paste uniformly.

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Fukuoka, Japan

Mitsuru Ozono