Ngk Insulators, Inc.

Mitsuru Ohta

Tsuneaki Ohashi

Tomoyuki Fujii

Takahiro Ishikawa

Masayuki Shinkai

Masahiro Kida

Masao Nishioka

Hisakazu Okajima

A heating device is provided, including an insulating ceramic base having a heating surface for heating an object. A high frequency electrode is embedded in the insulating ceramic base in the vicinity of the heating surface, and a heating body is embedded in the base in a location that is further from the heating surface than the location of the high frequency electrode. A low resistance ceramic member is provided so as to be exposed to a part of the heating surface of the insulating ceramic base and to be connected to a conductive member inside of the insulating ceramic base. A main component of the material of the low resistance ceramic member is common to that of the insulating ceramic base, and the respective thermal expansion coefficients are equivalent.

Heating device

An object of the present invention is to provide a heater having a ceramic substrate with a through hole formed therein so that the uniformity of temperature on the heating face of the substrate can be improved and the use life of the ceramic substrate can be improved upon thermal cycles. A ceramic heater comprises a substrate made of a ceramic material and having a heating face where three or more zonesC,F are allocated, heating resistances corresponding to the zones, respectively, and terminalsC electrically connected to the heating resistances, respectively. Three or more holesare formed in the substrate. Distances of the terminalsC and the wall surfaces facing the holesare 8 mm or more, respectively. The heating resistanceintersects a straight lineconnecting the center of the terminal and the centerof the hole in a plan view.

Ceramic heaters

A bonded member including a ceramic base materialand a metallic memberwhich are bonded together, wherein a solder materialcomprising Au is disposed on the surface of the ceramic base materialvia an active metal layer, the active metal layer and the solder materialare molten by heating so as to form a precoat layer, the metallic memberis disposed on the surface of the precoat layervia an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layerare molten by heating to bond the metallic memberand the precoat layer

Bonded member comprising different materials, and production method thereof

A joined structure of a metal terminal and a ceramic member has a joining layer between the terminal and the ceramic member. The joining layer has a metal adhesive layer containing at least indium metal. The invention further provides a joined structure of a metal member and a ceramic member. The metal member has a tip face and a side face. A hollow is formed in the ceramic member. A joining layer is formed between a bottom surface facing the hollow and the tip face of the member, and further formed between a side wall surface facing the hollow and the side face of the member. The joining layer has a metal adhesive layer containing at least indium metal.

Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials

A joined structure includes a metal terminal, a ceramic member and a joining layer between the metal terminal and the ceramic member. The joining layer includes a metal adhesive layer containing at least indium metal. The invention further provides a joined structure including a metal member, a ceramic member, and a joining layer. The metal member includes a tip face and a side face. A hollow portion is formed in the ceramic member. The joining layer is formed between a bottom surface facing the hollow portion and the tip face of member, and further formed between a side wall surface facing the hollow portion and the side face of the metal member. The joining layer also includes a metal adhesive layer containing at least indium metal.

Growing community of inventors

Inazawa, Japan

Mitsuru Ohta