Mitsubishi Gas Chemical Company, Inc.

Pi R&d Co., Ltd.

Other

Japan Vilene Company, Ltd.

Mitsuru Nozaki

Morio Gaku

Masashi Yano

Eiji Nagata

Kenji Ishii

Yasuo Tanaka

Yasumasa Norisue

Daisuke Ohno

Hidenori Kimbara

Akihiro Nomoto

Yoshinori Kondo

Seiji Shika

Jun Yokoi

Hidenori Kinbara

Koji Kimura

Tamemaru Esaki

Yasunari Osaki

Takabumi Omori

Michio Nawata

Naohiko Shimono

Yasuo Kikuchi

Masanobu Mizoguchi

Kenji Saimen

Norikatsu Akiyama

Takabumi Oomori

The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.

Resin composite electrolytic copper foil, copper clad laminate and printed wiring board

A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

Resin composite copper foil, printed wiring board, and production processes thereof

A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.

Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate

A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition. 

Resin composition and prepreg for laminate and metal-clad laminate

There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement contains a wet system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290&deg; C. or higher (component A) and a thermotropic cystalline polyester binder which has a melting point of 290&deg; C. or higher and is in the form of a film having holes including at least 5 holes/mm,each with an area of opening of 400 to 1000 &mgr;m,(component B), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring (base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.

Nonwoven reinforcement for printed wiring base board and process for producing the same

Sheet material for laminate of printed circuit and laminate for printed

The invention is a process for making a cyanate ester resin cured product by (1) adding organic metal compound (a) and triethanol amine(b) to a cyanate resin composition which is flowable at a temperature of not more than 50.degree. C. comprising as its main component polyfunctional cyanate ester compound having at least two cyanate groups, thereby forming a cyanate resin composition having 0.1-5% by weight of (a) and 0.1-5% by weight of (b), which is flowable at a temperature of not more than 50.degree. C.; (2) molding the composition at a temperature of not more than 50.degree. C. (3) primary curing at a temperature of not more than 50.degree. C.; and (4) post-curing at a temperature of not less than 170.degree. C.

Process for producing cyanate ester resin cure product

A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin composition, and a hard pin mold III having hard pins for forming holes fixed thereto in such a manner that

Process of producing plastic-molded printed circuit boards

A method for producing a rigid resin mold for preparing plastic moldings which comprises:

Method for producing rigid resin molds

Growing community of inventors

Tokyo, Japan

Mitsuru Nozaki