Sanyo Electric Co., Ltd.

Sanyo Semiconductor Co., Ltd.

Mitsuru Noguchi

Sadamichi Takakusaki

Masahiko Mizutani

Nobuhisa Takakusaki

Motoichi Nezu

Kazutoshi Motegi

A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.

Circuit substrate, circuit device and manufacturing process thereof

In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substratesare manufactured from a single metal substrateA' by dicing. In some embodiments, the method includes: preparing a metal substrateA&#x2032; having an insulating layerformed on the top surface thereof; forming a plurality of conductive patternson the top surface of insulating layer; forming groovesin lattice form on the rear surface of metal substrateB&#x2032;; mounting hybrid integrated circuits onto conductive patterns; and separating individual circuit substrateswith, for example, a rotatable cutter.

Methods for manufacturing a hybrid integrated circuit device

An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

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Nitta-gun, Japan

Mitsuru Noguchi