Ebara Corporation

Oiles Corporation

Other

Okumura Corporation

Tokyo Denki University Oiles Corporation

Mitsuru Miyazaki

Junji Kunisawa

Takuya Inoue

Seiji Katsuoka

Kenichi Kobayashi

Naoki Toyomura

Takahiro Ogawa

Toshio Yokoyama

Masahiko Sekimoto

Teruyuki Watanabe

Naoki Matsuda

Hiroyuki Shinozaki

Kuniaki Yamaguchi

Hiroshi Sotozaki

Akira Imamura

Osamu Nabeya

Natsuki Makino

Shinya Morisawa

Tomoaki Fujimoto

Itsuki Kobata

Toshio Mizuno

Koichi Fukaya

Fumitoshi Oikawa

Masami Mochimaru

Yasuyuki Motojima

Akio Suzuki

Yasuyuki Motoshima

Ikuo Shimoda

Akira Owatari

Masayoshi Imai

Teruaki Hombo

Naoki Dai

Sumio Kawaguchi

Koji Maeda

Koji Maruyama

Manao Hoshina

Fujihiko Toyomasu

Takeshi Sakurai

Masayuki Kumekawa

Eiji Hirai

Kaoru Hamaura

Kenichi Suzuki

Katsuhide Watanabe

Toru Maruyama

Hideo Aizawa

Hiroshi Aono

Yuichi Iwasaki

Xinming Wang

Hisajiro Nakano

Haiyang Xu

Hiroshi Shimomoto

Koichi Hashimoto

Mitsuhiko Inaba

Go Tanaka

Hidetatsu Isokawa

Kenji Shinkai

Kazuki Chiba

Takeshi Iizumi

Katsuhiko Tokushige

Hideo Ozawa

Tetsuya Yashima

Kazuhiro Nagashima

Kunimasa Matsushita

Suguru Ogura

Kiyoharu Suzuki

Hao Yu

Susumu Otsuka

Shunsuke Matsuzawa

Shozo Takahashi

Kenji Fujimoto

Naoki Noji

Kunio Hayakawa

Kazuaki Shiki

Lien Yin Cheng

Boyu Dong

Satoshi Fujita

Kazuhiko Sasaki

The present invention relates to a substrate processing apparatus for processing a substrate. The substrate processing apparatus () includes a controller (). The controller () rotates the substrate (W) at a second speed, after rotating the substrate (W) at a first speed. The controller () supplies a dry fluid from a dry fluid nozzle () onto the substrate (W) for predetermined time after rotating the substrate (W) at the second speed, and while rotating the substrate (W) at a third speed. The controller () moves a dry fluid nozzle () from a center of the substrate (W) toward a peripheral portion of the substrate (W) while continuing to supply the dry fluid from the dry fluid nozzle ().

Substrate processing apparatus, computer-readable storage medium storing a program, and substrate processing method

A substrate cleaning apparatus includes a substrate rotation supporting section that supports and rotates a substrate; a roll holding section that rotatably holds a first roll cleaning member and a second roll cleaning member each having a length almost equal to a radius of the substrate; a roll rotation drive section that rotates the first roll cleaning member and the second roll cleaning member about respective axes of rotation parallel to a front surface of the substrate; and a roll pressing section that brings the first roll cleaning member and the second roll cleaning member that are rotating into sliding contact with the front surface of the substrate. The first roll cleaning member and the second roll cleaning member are disposed so as to cover different radial parts of the front surface of the substrate.

Substrate cleaning apparatus and substrate cleaning method

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

Substrate processing apparatus

A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

Cleaning apparatus and polishing apparatus

A substrate cleaning apparatus has: a substrate rotating part that rotates a substrate; an edge cleaning member for cleaning an edge part of the substrate; an edge rotating part that rotates the edge cleaning member around an edge rotary shaft that extends in a direction orthogonal to a substrate rotary shaft; a moving part that moves a position of the edge cleaning member with respect to the edge part of the substrate; and a control part that controls the moving part to move the position of the edge cleaning member with respect to the edge part of the substrate, and causes the edge cleaning member to clean a one-side edge area including a face on one side, a side face area including a side face, and an another-side edge area including a face on another side in the edge part of the substrate.

Substrate cleaning apparatus and cleaning method of substrate

Exemplary substrate supporting apparatus and method for attaching and/or detaching substrate are provided. In one aspect, substrate supporting apparatus has a plurality of supporting membersthat contacts a circumferential part of a substrate W and rotate the substrate W; a pair of driven memberson which the plurality of supporting membersare provided; a connecting memberconnecting one driven memberand another driven member; and a driving devicethat brings the pair of driven membersclose to each other or separates the pair of driven membersfrom each other, linearly along a first direction, by moving at least a part of the connecting member. Numerous other aspects are provided.

Substrate supporting apparatus and method of controlling substrate supporting apparatus

A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

Jig and installation method using same jig

A transport apparatus includes a hand, a drive mechanism, a cover member, and a gas supply member. The hand is configured to hold a wafer. The drive mechanism is configured to transport the wafer by moving the hand. The cover member has an opposing surface opposed to a surface of the wafer held by the hand and is formed with a plurality of holes opened in the opposing surface. The gas supply member is configured to supply an inert gas to the surface of the wafer via the plurality of holes of the cover member. The plurality of holes are formed in the opposing surface so that an opening ratio of an outer peripheral portion of the opposing surface is higher than an opening ratio of a central portion of the opposing surface.

Transport apparatus and substrate processing apparatus

The present invention relates to a damper control system and a damper control method for controlling an opening degree of an exhaust damper connected to an exhaust duct. The damper control system () includes an exhaust damper (), a first pressure sensor (), and a controller () configured to control an opening degree of the exhaust damper (). The controller () is configured to switch the opening degree of the exhaust damper () to an opening degree smaller than a full opening on condition that a shutter () is opened.

Damper control system and damper control method

The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanismincludes a first support partwhich is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substrate W in a closed state, a second support partwhich supports the other surface of the substrate W, and a first support part moving partwhich swings the first support part

Substrate support mechanism, substrate cleaning device and substrate processing method

A cleaning member mounting mechanism has: a cleaning member holding part, to which a cleaning member assembly having a cleaning member for cleaning a substrate W can be mounted; a member rotation part for rotating the cleaning member assembly held by the cleaning member holding part; and a moving part which moves the cleaning member holding part along an axial direction when the cleaning member assembly is removed, thereby to bring the cleaning member holding part into a rotation fixed position to restrict a rotation of the cleaning member holding part.

Cleaning member mounting mechanism and substrate cleaning apparatus

A sensor target cover capable of preventing an optical liquid level detection sensor from erroneously detecting a rise in a liquid level is provided. A sensor target cover is used in combination with an optical liquid level detection sensor. The sensor target cover includes a reflecting plate, an inner wall structure surrounding the reflecting plate, and an outer wall structure surrounding the inner wall structure. A gap is formed between the inner wall structure and the outer wall structure.

Sensor target cover used in combination with liquid level detection sensor, wet processing device, substrate processing device, and sensor assembly

A substrate support apparatushas a support partfor supporting a substrate W; a moving partwhich is adapted to abut on the support partand to move the support partalong an axis direction; a fluid pipeat least a part of which is provided in the moving part, through which fluid flows and an outlet portof which is covered by the support partwhen the moving partabuts on the support part; and a detection partwhich detects a state of the fluid.

Substrate support apparatus and substrate cleaning apparatus

Growing community of inventors

Tokyo, Japan

Mitsuru Miyazaki