Nec Corporation

Aio Core Co., Ltd.

Nec C Orporation

Photonics Electronics Technology Research Association

Mitsuru Kurihara

Kazuhiko Kurata

Shigeru Kobayashi

Kazuhiro Shiba

Shinya Watanabe

Kaichiro Nakano

Junichi Sasaki

Hikaru Kouta

Mikio Oda

Ichiro Ogura

Ichiro Hatakeyama

Taro Kaneko

Hisaya Takahashi

Koichi Takemura

Kazunori Miyoshi

Kenji Yamauchi

Mitsunori Kanemoto

Toshinori Uemura

Akio Ukita

Provided is an optical module having high efficiency in optical coupling to a functional element on a substrate. An optical module includes: a first optical waveguide disposed parallel to a substrate; a condensing mirror configured to reflect and condense light propagated in the first optical waveguide toward the substrate; a second optical waveguide formed in a tapered shape narrowed toward the substrate, the second optical waveguide guiding the light reflected by the condensing mirror to the vicinity of the surface of the substrate; and an optical function unit disposed on the substrate such that the light emitted from the second optical waveguide is incident on the optical function unit.

Optical module

To provide an opto-electric module that can be cooled efficiently. An opto-electric module comprises: an opto-electric hybrid device provided with an electronic circuit and an optical circuit driven by the electronic circuit, the opto-electric hybrid device having a first surface and a second surface on an opposite side from the first surface, such that an electrical input and output unit with respect to the electronic circuit and an optical input and output unit with respect to the optical circuit are disposed on the first surface; an interface substrate which is disposed near the first surface of the opto-electric hybrid device and which is provided with an electrical interconnect coupled to the electrical input and output unit, an optical interconnect coupled to the optical input and output unit, an electrical interface which is connected to the electrical interconnect and also connectible to an external electrical interconnect, and an optical interface which is connected to the optical interconnect and also connectible to an external optical interconnect; and a heat-dissipating member disposed in contact with the second surface of the opto-electric hybrid device.

Opto-electric module

A photoelectric hybrid device includes an optical connector on a flat optical surface at one end of vertical optical waveguides for inputting and outputting an optical signal. Integration of the photoelectric hybrid device into an interposer or the like is standardized. The photoelectric hybrid device includes: conductive pins connected to an electric signal pathway for a photoelectric hybrid substrate; a translucent member having a flat optical surface and a translucent part; and self-organizing optical waveguides that form an optical path between the translucent part and an optical waveguide. The flat optical surface is not lower than the tops of the electrical connection parts on the conductive pins. Collision of the optical connector and the tops of the electrical connection parts can be avoided when an optical connector on which an optical waveguide that transmits an optical signal among the optical waveguides.

Photoelectric hybrid device and method for manufacturing same

An optical transmission module is provided which has excellent long-term reliability, high manufacturing efficiency and a smaller optical output loss and which facilitate its downsizing, weight saving and high integration. The optical transmission module is provided with a first optical deviceplaced on an output side, a second optical deviceplaced on the first optical devicealigned with an optical axis of the first optical device, a packageincluding the first and second optical devicesand, and an optical fiberconfigured to guide light emitted from the first optical deviceto the outside of the package. The first optical deviceand the second optical deviceare in close contact with each other on the surface perpendicular to the optical axis.

Optical transmission module and manufacturing method thereof

To obtain an optical waveguide device capable of improving mounting accuracy and productivity for correcting misalignment of alignment marker caused by distortion due to a substrate stressed and distorted. An optical waveguide device includes an optical waveguide section, including a waveguide core formed on a substrate, and an optical device (LD) mounted on the substrate to correspond the optical waveguide section, both of which are coupled at a light end face and mounted by hybrid mounting. LD side alignment markers are provided in both sides of an active line in the optical device. Substrate side alignment markers are provided at positions where centers thereof and those of the optical device side markers are matched when the optical device is mounted on the corresponding substrate. Fiducial markers are provided and a relative positional relationship with the waveguide core on the substrate becomes stably. Thus, a misalignment amount is detected.

Optical waveguide device and manufacturing method for optical waveguide device

An optical waveguide module includes a wiring board, and a light-receiving element and optical waveguide substrate that are positioned on both sides of this wiring board. The wiring board includes a base member having transparency to light of the wavelength that can be received by the light-receiving element; surface electrical wiring on the surface of the base member, and filter film on the rear surface of the base member for passing only light of the wavelength that can be received by the light-receiving element and for reflecting light of other wavelengths. An aperture larger than the core of the optical waveguide is formed in the surface electrical wiring. The light-receiving element () is flip-chip mounted on surface electrical wiring () using bumps (), and the light-receiving region () of the light-receiving element () is arranged to face the wiring board ().

Optical waveguide module

An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

A method for connecting an optical waveguide and an optical semiconductor device and an apparatus for connecting the same, capable of removing a working error and getting a high optical coupling coefficiency. The method consisting of the steps of: moving the optical semiconductor device to the substrate so as to overlap the pair of the first positioning marks and the pair of the second positioning marks; obtaining an actual distance from the outgoing surface to the pair of the second positioning marks, based on an image photographed by allowing the infrared ray to transmit through the substrate and the optical semiconductor device; obtaining an error between the actual distance and a designed distance previously set, by subtracting the designed distance between the outgoing surface of the optical semiconductor device and the pair of the second positioning marks from the actual distance; moving the pair of the second positioning marks relative to the pair of the first positioning marks by a quantity equal to the error so as to cancel the error; and jointing the optical semiconductor device to the substrate.

Method for connecting optical waveguide and optical semiconductor device and apparatus for connecting the same

To provide parts soldering apparatus and method which improve the productivity during parts soldering and increase the mounting accuracy of parts on a circuit board. The parts soldering apparatus of the present invention has: a stage for positioning a circuit board whereon, the circuit board is mounted a solder tip whereon; a loading arm made of a light-transmitting material, for loading a part onto the solder tip; a fluctuating mechanism for pressing the loading arm toward the circuit board; and an optical source for irradiating light onto the part through the loading arm and for melting the solder tip by the conductive heat of the light irradiated onto the part.

Growing community of inventors

Tokyo, Japan

Mitsuru Kurihara