Pioneer Corporation

Pioneer Micro Technology Corporation

Mitsuru Koarai

Hirokazu Takahashi

Kenjiro Fujimoto

Masahiro Ishimori

Tomotaka Yabe

Naoki Noda

Toshio Yokouchi

Yuji Fukasawa

An electronic device is obtained in such a way that a MEMS substrate having a MEMS element mounted thereon and a CMOS substrate are bonded together at bonding surfaces and with a bonding material M having fluidity, wherein the MEMS substrate has a bonding projection part provided to project from a substrate main body and having the bonding surface and a gap formation part disposed between the bonding projection part and the MEMS element, and the gap formation part is supported by the bonding projection part via a plurality of support pieces extending from the bonding projection part and forms reception gaps, which are capable of receiving the bonding material M extruded from the bonding surface to the side of the MEMS element, between the wall surface thereof and the bonding projection part.

Electronic device

An electronic devicehas a first semiconductor substrateon which a bonding projection sectionis projected via an insulation film, a second semiconductor substratethat is bonded by welding the bonding projection sectionof the first semiconductor substratevia conductive bonding material, a through holethat is formed to penetrate the bonding projection sectionand the insulation filmin a bonding direction, and a conduction wiring sectionthat is formed by the conductive bonding material filled in the through holeat a time of bonding by welding and conducts the first semiconductor substratewith the second semiconductor substrateto have same electric potential.

Electronic device and fabrication method thereof

Growing community of inventors

Yamanashi, Japan

Mitsuru Koarai