Disco Corporation

Mitsuru Ikushima

Yoshinori Kakinuma

Yoshikuni Migiyama

Kazuki Sugiura

Takashi Mori

Makoto Saito

Emiko Kawamura

Yoshinobu Saito

Shinichi Namioka

Jonghyun Ryu

Takashi Uchiho

Yohei Masuda

Yuta Taniyama

A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to the annular frame, and a second tape pressure bonding unit that includes a second pressure bonding roller for executing pressure bonding of the tape of the tape-attached annular frame to a front surface or a back surface of the wafer. A first heating unit is disposed in one of or both the frame table and the first pressure bonding roller, while a second heating unit is disposed in one of or both the wafer table and the second pressure bonding roller.

Processing apparatus for integrating a semiconductor wafer and an annular frame through a tape

A resin applying machine includes a processing chamber, a temperature measuring unit, and a controller. The processing chamber houses therein a holder for holding the wafer, a table that faces the holder, a resin supply unit for supplying a liquid resin to the table, a moving unit for relatively moving the holder and the table closely to each other, and a hardening unit for hardening the liquid resin that has coated the wafer. The temperature measuring unit measures a temperature in the processing chamber. The controller includes a correlation data storage unit for recording therein correlation data with respect to the temperature in the processing chamber and a moved distance by which the holder and the table are relatively moved by the moving unit at the temperature.

Resin applying machine

There is provided a processing method including the steps of measuring a thickness of the wafer, holding the wafer on a holder, supplying a liquid resin to a table that faces the holder, relatively moving the holder and the table closely to each other to coat the wafer with the liquid resin, and hardening the liquid resin that has coated the wafer. In the resin applying step, a distance by which the holder and the table are to be relatively moved closely to each other to coat the wafer with the liquid resin is determined depending on the measured thickness of the wafer.

Processing method and resin applying machine

A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.

Protective sheet disposing method

Growing community of inventors

Tokyo, Japan

Mitsuru Ikushima