Nitto-denko Corporation

Mitsuru Honjo

Masami Inoue

Masayuki Hodono

Daisuke Yamauchi

Tetsuya Oosawa

Yuichi Tsujita

Akiko Nagafuji

Tadao Ookawa

Toshiki Naitou

Takashi Oda

Tetsuya Ohsawa

Jun Ishii

Toshiki Naito

Naoyuki Tanaka

Katsutoshi Kamei

Takeshi Tanaka

Tomotake Nashiki

Hiroshi Yamazaki

Hiroshi Wada

Takezo Hatanaka

Ikuo Kawamoto

Hiroaki Kishioka

Kei Nakamura

Kazumasa Igarashi

Yasufumi Miyake

Tomohide Banba

Toshihiko Sugimoto

Ryusuke Naito

Yoshihiko Takeuchi

Naoki Nagaoka

Yuki Saitou

Yuki Hasegawa

Yuki Tsubaki

Yoshifumi Yamamoto

Natsuko Yamazaki

Yoshifumi Morita

Daisuke Yamuchi

Provided is a capacitive touch panel which has enhanced sensitivity and is usable in an image display panel, etc. in this capacitive touch panel, a window, a first transparent film having a first transparent conductive electrode pattern formed on one surface thereof, and a second transparent film having a second transparent conductive electrode pattern which is formed on one surface thereof and disposed with respect to the first transparent film in such a manner as to allow a capacitance to be formed therebetween, are stacked in turn. The capacitive touch panel comprises a first transparent inter-layer resin provided between the window and the first transparent film, and a second transparent inter-layer resin provided between the first transparent film and the second transparent film, wherein the first transparent inter-layer resin has a dielectric constant greater than that of the second transparent inter-layer resin.

Capacitive touch panel

First and second conductor layers are formed on a main surface of a base layer. A tapered slot is formed between the first and second conductive layers. A first slit is formed at the first conductor layer, and a second slit is formed at the second conductor layer. Thus, the first conductor layer is divided into a first device connection portion and a first antenna portion, and the second conductor layer is divided into a second device connection portion and a second antenna portion. A semiconductor device is connected to the first and second device connection portions.

Antenna module and method for manufacturing the same

In the disclosed magnetic element () for wireless power transmission, in a cross section that matches the direction of magnetic coupling, a conductor section () and a magnetic material section () that abuts the conductor section () are disposed in parallel in a direction perpendicular to the direction of magnetic coupling, and one of either the conductor section () or the magnetic material section () has a protruding region () that protrudes in the direction of magnetic coupling more than the other does.

Magnetic element for wireless power transmission and power supply device

Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes fitting holes which are formed in a surface of an overcladding layer and are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes protruding portions which fit into the fitting holes and are located and formed at predetermined locations with respect to the optical element.

Opto-electric hybrid board and manufacturing method therefor

A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.

Method for manufacturing printed circuit board

A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.

Printed circuit board and method of manufacturing the same

A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.

A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.

Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.

Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.

An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness tof the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 &#x3a9;.

Flexible printed circuit board

A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

Method of manufacturing a printed circuit board

A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 &#x3bc;m, and the distance between the adjacent wiring traces is set to not less than 8 &#x3bc;m. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 &#x3a9; and not more than 50 &#x3a9;.

Printed circuit board and magnetic head driving device including the same

A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover the wide parts. The conductive layer is provided on the first cover insulating layer so as to cover a portion above the wide parts.

Growing community of inventors

Ibaraki, Japan

Mitsuru Honjo