Intel Corporation

Ngk Spark Plug Company, Limited

Ngk Spark Plugs (u.s.a.), Inc.

Mitsuru Hirano

Bidyut K Bhattacharyya

Kozo Yamasaki

Michael A Schmitt

Naomiki Kato

Masahiro Ogawa

Kouichi Mouri

An alumina multilayer wiring substrate having a high dielectric, low inductance capacitor in the substrate on which a VLSI is to be mounted to effectively eliminate electrical noise(s) which may hinder the operation of the VLSI at high speed (frequency) is provided.

Alumina multilayer wiring substrate provided with high dielectric

A ceramic multilayer wiring substrate is provided on which the metallized wirings are partially altered to provide multiple resistivities without changing the other electrical properties associated with a particular physical wiring geometry. Sequentially positioning conductive materials of different resistivities along the length of each individual wiring produces a final wiring pattern where each individual wiring can have a different resistance from the other wirings. A multiple resistivity wiring pattern can maximize the operation of a semiconductor chip attached thereto, for example, by reducing the effect of electronic noise on the semiconductor.

Multiple resistivity wiring apparatus

Growing community of inventors

Santa Clara, CA, United States of America

Mitsuru Hirano